Inventor · disambiguated record
Mikio Nishio
Also filed as: NISHIO MIKIO
16 granted patents·684 citations·filing 1991–2001
95Inventor score
Top patents by PatentIndex Score
16 records- 0195US5645628AElectroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 8, 1997·182 cites·2 claims
- 0289US6012967APolishing method and polishing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 11, 2000·114 cites·32 claims
- 0388US5769697AMethod and apparatus for polishing semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 23, 1998·75 cites·16 claims
- 0479US5795828AElectroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 18, 1998·43 cites·9 claims
- 0577US5997385AMethod and apparatus for polishing semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 7, 1999·41 cites·2 claims
- 0674US5791973AApparatus for holding substrate to be polished and apparatus and method for polishing substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 11, 1998·41 cites·9 claims
- 0773US5921853AApparatus for polishing substrate using resin film or multilayer polishing padMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 13, 1999·36 cites·6 claims
- 0873US5223729ASemiconductor device and a method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jun 29, 1993·45 cites·10 claims
- 0960US5866480AMethod and apparatus for polishing semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Feb 2, 1999·21 cites·10 claims
- 1058US6099390APolishing pad for semiconductor wafer and method for polishing semiconductor waferMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Aug 8, 2000·19 cites·16 claims
- 1153US5939132AAlignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Aug 17, 1999·16 cites·9 claims
- 1251US6074289AApparatus for holding substrate to be polishedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 13, 2000·18 cites·11 claims
- 1351US5451261AMetal film deposition apparatus and metal film deposition methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Sep 19, 1995·18 cites·7 claims
- 1449US6812493B2Thin-film semiconductor element and method of producing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 2, 2004·4 cites·17 claims
- 1536US5868610AMehtod and aparatus for polishing semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Feb 9, 1999·4 cites·7 claims
- 1635US5683921ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 4, 1997·7 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →