Inventor · disambiguated record
Hsien-Wei Chin
Also filed as: CHIN HSIEN W · CHIN HSIEN WEI
11 granted patents·125 citations·filing 1994–2011
89Inventor score
Top patents by PatentIndex Score
11 records- 0167US5879966AMethod of making an integrated circuit having an opening for a fuseTAIWAN SEMICONDUCTOR MFG·Filed 1994·Granted Mar 9, 1999·33 cites·7 claims
- 0260US5965927AIntegrated circuit having an opening for a fuseTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Oct 12, 1999·23 cites·17 claims
- 0359US5494848ABuried contact trench processTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Feb 27, 1996·27 cites·29 claims
- 0452US5926697AMethod of forming a moisture guard ring for integrated circuit applicationsTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jul 20, 1999·18 cites·23 claims
- 0549US8124494B2Method for reshaping silicon surfaces with shallow trench isolationWANG YU-HSIUNG·Filed 2007·Granted Feb 28, 2012·0 cites·20 claims
- 0648US8253206B2Method for reshaping silicon surfaces with shallow trench isolationWANG YU-HSIUNG·Filed 2011·Granted Aug 28, 2012·0 cites·20 claims
- 0742US5705436AMethod for forming a poly load resistorTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jan 6, 1998·8 cites·18 claims
- 0840US5593922AMethod for buried contact isolation in SRAM devicesTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jan 14, 1997·7 cites·34 claims
- 0938US5646057AMethod for a MOS device manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Jul 8, 1997·7 cites·7 claims
- 1035US7016029B2Detection of lens anti-reflective coating decay by undesired residue detectionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 21, 2006·0 cites·20 claims
- 1131US6017828AMethod for preventing backside polysilicon peeling in a 4T+2R SRAM processTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jan 25, 2000·2 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Hsien-Wei Chin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →