Inventor · disambiguated record
Akira Tanahashi
Also filed as: TANAHASHI AKIRA
8 granted patents·82 citations·filing 1995–2010
85Inventor score
Top patents by PatentIndex Score
8 records- 0191US7793820B2Solder preform and a process for its manufactureSENJU METAL INDUSTRY CO·Filed 2008·Granted Sep 14, 2010·31 cites·19 claims
- 0275US10081852B2Solder preform and a process for its manufactureHIRANO NAOHIKO·Filed 2010·Granted Sep 25, 2018·2 cites·14 claims
- 0370US7601625B2Method for manufacturing semiconductor device having solder layerDENSO CORP·Filed 2005·Granted Oct 13, 2009·5 cites·12 claims
- 0463US5919317ASoldering flux, soldering paste and soldering method using the sameNIPPON DENSO CO·Filed 1995·Granted Jul 6, 1999·27 cites·14 claims
- 0562US7361996B2Semiconductor device having tin-based solder layer and method for manufacturing the sameDENSO CORP·Filed 2005·Granted Apr 22, 2008·2 cites·12 claims
- 0648US7579212B2Semiconductor device having tin-based solder layer and method for manufacturing the sameDENSO CORP·Filed 2007·Granted Aug 25, 2009·0 cites·16 claims
- 0744US6142363ASoldering method using soldering flux and soldering pasteNIPPON DENSO CO·Filed 1999·Granted Nov 7, 2000·11 cites·25 claims
- 0832US6488781B1Soldering paste, soldering method, and surface-mounted type electronic deviceDENSO CORP·Filed 1999·Granted Dec 3, 2002·4 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Akira Tanahashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →