Inventor · disambiguated record
Akemi Kawaguchi
Also filed as: KAWAGUCHI AKEMI
7 granted patents·288 citations·filing 1995–1998
88Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD7
Top patents by PatentIndex Score
7 records- 0195US5645628AElectroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 8, 1997·182 cites·2 claims
- 0279US5795828AElectroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 18, 1998·43 cites·9 claims
- 0359US5953628AMethod for forming wiring for a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Sep 14, 1999·25 cites·7 claims
- 0452US5863834ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 26, 1999·18 cites·6 claims
- 0541US5820746AMetal surface state evaluation method and semiconductor device production methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 13, 1998·8 cites·13 claims
- 0639US6372928B1Layer forming material and wiring forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 16, 2002·7 cites·1 claims
- 0736US5773639ALayer forming material and wiring forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 30, 1998·5 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Akemi Kawaguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →