Inventor · disambiguated record
Peter F. Dawson
Also filed as: DAWSON PETER F
4 granted patents·214 citations·filing 1992–1995
81Inventor score
Technology areasH10W
Files withHEWLETT PACKARD CO2
Top patents by PatentIndex Score
4 records- 0190US5621615ALow cost, high thermal performance package for flip chips with low mechanical stress on chipHEWLETT PACKARD CO·Filed 1995·Granted Apr 15, 1997·135 cites·5 claims
- 0271US5484964ASurface mounting pin grid arraysFiled 1995·Granted Jan 16, 1996·50 cites·9 claims
- 0350US5268048AReworkable die attachmentHEWLETT PACKARD CO·Filed 1992·Granted Dec 7, 1993·22 cites·2 claims
- 0429US5749988AReworkable die attachment to heat spreaderFiled 1994·Granted May 12, 1998·7 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →