Inventor · disambiguated record
Kazumi Higashi
Also filed as: HIGASHI KAZUMI
12 granted patents·1 pending application·442 citations·filing 1986–2008
93Inventor score
Top patents by PatentIndex Score
13 records- 0191US4880895APolyimide film-forming polyamide acid solutionNITTO ELECTRIC IND CO·Filed 1987·Granted Nov 14, 1989·94 cites·10 claims
- 0289US5374469AFlexible printed substrateNITTO DENKO CORP·Filed 1992·Granted Dec 20, 1994·116 cites·46 claims
- 0385US4876330AColorless transparent polyimide shaped article and process for producing the sameNITTO ELECTRIC IND CO·Filed 1986·Granted Oct 24, 1989·59 cites·17 claims
- 0484US5438223AAnisotropic electrically conductive adhesive film and connection structure using the sameNITTO DENKO CORP·Filed 1993·Granted Aug 1, 1995·79 cites·16 claims
- 0579US4874834AColorless transparent polyimide shaped article and process for producing the sameNITTO ELECTRIC IND CO·Filed 1987·Granted Oct 17, 1989·25 cites·11 claims
- 0658US5595856AHeat-resistant photoresist composition and negative-type pattern formation methodNITTO DENKO CORP·Filed 1996·Granted Jan 21, 1997·16 cites·7 claims
- 0758US4955900AIntra-ocular lensNITTO DENKO CORP·Filed 1989·Granted Sep 11, 1990·10 cites·4 claims
- 0852US5578696AHeat resistant adhesive film, an adhesion structure, and method of adhesionNITTO DENKO CORP·Filed 1994·Granted Nov 26, 1996·15 cites·5 claims
- 0945US6132930ANegative photoresist compositionNITTO DENKO CORP·Filed 1999·Granted Oct 17, 2000·11 cites·5 claims
- 1044US2009162617A1Backlight system and optical sheet with pressure-sensitive adhesiveNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1142US5645979AHeat-resistant photoresist composition and negative-type pattern formation methodNITTO DENKO CORP·Filed 1996·Granted Jul 8, 1997·7 cites·7 claims
- 1233US5723206APolyimide-metal foil composite filmNITTO DENKO CORP·Filed 1996·Granted Mar 3, 1998·3 cites·5 claims
- 1332US5049156AIntra-ocular lensNITTO DENKO CORP·Filed 1990·Granted Sep 17, 1991·7 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →