Inventor · disambiguated record
Jeffrey P. Gambino
Also filed as: GAMBINO JEFFREY · GAMBINO JEFFREY P · GAMBINO JEFFREY PETER
584 granted patents·72 pending applications·7,549 citations·filing 1991–2025
99Inventor score
Files withIBM440DAUBENSPECK TIMOTHY H31SEMICONDUCTOR COMPONENTS IND LLC28GAMBINO JEFFREY P26GLOBALFOUNDRIES INC24
Top patents by PatentIndex Score
656 records- 0199US9455187B1Backside device contactIBM·Filed 2015·Granted Sep 27, 2016·40 cites·18 claims
- 0299US7193423B1Wafer-to-wafer alignmentsIBM·Filed 2005·Granted Mar 20, 2007·231 cites·4 claims
- 0398US9715064B1Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguidesGLOBALFOUNDRIES INC·Filed 2016·Granted Jul 25, 2017·52 cites·20 claims
- 0498US9514987B1Backside contact to final substrateIBM·Filed 2015·Granted Dec 6, 2016·18 cites·7 claims
- 0598US7323780B2Electrical interconnection structure formationIBM·Filed 2005·Granted Jan 29, 2008·62 cites·11 claims
- 0698US6720213B1Low-K gate spacers by fluorine implantationIBM·Filed 2003·Granted Apr 13, 2004·277 cites·15 claims
- 0798US6689650B2Fin field effect transistor with self-aligned gateIBM·Filed 2001·Granted Feb 10, 2004·216 cites·11 claims
- 0898US6590259B2Semiconductor device of an embedded DRAM on SOI substrateIBM·Filed 2001·Granted Jul 8, 2003·177 cites·16 claims
- 0998US6350653B1Embedded DRAM on silicon-on-insulator substrateIBM·Filed 2000·Granted Feb 26, 2002·236 cites·9 claims
- 1097US8871549B2Biological and chemical sensorsIBM·Filed 2013·Granted Oct 28, 2014·33 cites·26 claims
- 1197US7781781B2CMOS imager array with recessed dielectricIBM·Filed 2006·Granted Aug 24, 2010·65 cites·11 claims
- 1297US7759755B2Anti-reflection structures for CMOS image sensorsIBM·Filed 2008·Granted Jul 20, 2010·45 cites·16 claims
- 1397US7622364B2Bond pad for wafer and package for CMOS imagerIBM·Filed 2006·Granted Nov 24, 2009·61 cites·5 claims
- 1497US7285477B1Dual wired integrated circuit chipsIBM·Filed 2006·Granted Oct 23, 2007·49 cites·23 claims
- 1597US7205627B2Image sensor cellsIBM·Filed 2005·Granted Apr 17, 2007·44 cites·9 claims
- 1696US9911708B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted Mar 6, 2018·9 cites·20 claims
- 1796US8957405B2Graphene field effect transistorIBM·Filed 2013·Granted Feb 17, 2015·20 cites·9 claims
- 1896US8742594B2Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstopDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jun 3, 2014·30 cites·15 claims
- 1996US8508043B2Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bumpDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 13, 2013·24 cites·19 claims
- 2096US8053814B2On-chip embedded thermal antenna for chip coolingIBM·Filed 2009·Granted Nov 8, 2011·44 cites·16 claims
- 2196US7943428B2Bonded semiconductor substrate including a cooling mechanismIBM·Filed 2008·Granted May 17, 2011·33 cites·2 claims
- 2296US7825511B2Undercut-free BLM process for Pb-free and Pb-reduced C4IBM·Filed 2009·Granted Nov 2, 2010·37 cites·7 claims
- 2396US7335577B2Crack stop for low K dielectricsIBM·Filed 2005·Granted Feb 26, 2008·47 cites·9 claims
- 2496US7232711B2Method and structure to prevent circuit network charging during fabrication of integrated circuitsIBM·Filed 2005·Granted Jun 19, 2007·41 cites·20 claims
- 2595US10431614B2Edge seals for semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 1, 2019·21 cites·10 claims
- 2695US10090342B1Stacked image sensor capacitors and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·40 cites·19 claims
- 2795US9679806B1Nanowires for pillar interconnectsIBM·Filed 2016·Granted Jun 13, 2017·11 cites·7 claims
- 2895US9583451B2Conductive pillar shaped for solder confinementIBM·Filed 2015·Granted Feb 28, 2017·8 cites·19 claims
- 2995US9252733B2Switchable filters and design structuresIBM·Filed 2014·Granted Feb 2, 2016·9 cites·18 claims
- 3095US8847401B2Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structureIBM·Filed 2012·Granted Sep 30, 2014·22 cites·25 claims
- 3195US8791016B2Through silicon via wafer, contacts and design structuresIBM·Filed 2012·Granted Jul 29, 2014·20 cites·20 claims
- 3295US8609450B2MEMS switches and fabrication methodsGAMBINO JEFFREY P·Filed 2010·Granted Dec 17, 2013·17 cites·16 claims
- 3395US8604618B2Structure and method for reducing vertical crack propagationCOONEY III EDWARD C·Filed 2011·Granted Dec 10, 2013·24 cites·21 claims
- 3495US8021950B1Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formationIBM·Filed 2010·Granted Sep 20, 2011·20 cites·20 claims
- 3595US7524694B2Funneled light pipe for pixel sensorsIBM·Filed 2005·Granted Apr 28, 2009·40 cites·3 claims
- 3695US7482675B2Probing pads in kerf area for wafer testingIBM·Filed 2005·Granted Jan 27, 2009·40 cites·8 claims
- 3795US7193289B2Damascene copper wiring image sensorIBM·Filed 2004·Granted Mar 20, 2007·89 cites·10 claims
- 3895US7129545B2Charge modulation network for multiple power domains for silicon-on-insulator technologyIBM·Filed 2005·Granted Oct 31, 2006·46 cites·8 claims
- 3994US10309919B2Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2018·Granted Jun 4, 2019·5 cites·13 claims
- 4094US9627575B2Photodiode structuresIBM·Filed 2014·Granted Apr 18, 2017·9 cites·13 claims
- 4194US9184112B1Cooling apparatus for an integrated circuitIBM·Filed 2014·Granted Nov 10, 2015·18 cites·20 claims
- 4294US8910355B2Method of manufacturing a film bulk acoustic resonator with a loading elementADKISSON JAMES W·Filed 2011·Granted Dec 16, 2014·19 cites·19 claims
- 4394US8765502B2Germanium photodetector schottky contact for integration with CMOS and Si nanophotonicsASSEFA SOLOMON·Filed 2012·Granted Jul 1, 2014·9 cites·11 claims
- 4494US8563336B2Method for forming thin film resistor and terminal bond pad simultaneouslyCHEN FEN·Filed 2008·Granted Oct 22, 2013·18 cites·16 claims
- 4594US8492897B2Microstructure modification in copper interconnect structuresCABRAL JR CYRIL·Filed 2011·Granted Jul 23, 2013·15 cites·10 claims
- 4694US7893468B2Optical sensor including stacked photodiodesIBM·Filed 2008·Granted Feb 22, 2011·25 cites·10 claims
- 4794US7829945B2Lateral diffusion field effect transistor with asymmetric gate dielectric profileIBM·Filed 2007·Granted Nov 9, 2010·31 cites·12 claims
- 4894US7772028B2CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefromIBM·Filed 2007·Granted Aug 10, 2010·27 cites·23 claims
- 4994US7670921B2Structure and method for self aligned vertical plate capacitorIBM·Filed 2006·Granted Mar 2, 2010·31 cites·12 claims
- 5094US7662722B2Air gap under on-chip passive deviceIBM·Filed 2007·Granted Feb 16, 2010·31 cites·17 claims
Showing the top 50 of 656 patent records by PatentIndex Score.
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