Inventor · disambiguated record
David H. Carey
Also filed as: CAREY DAVID · CAREY DAVID H
17 granted patents·1 pending application·1,929 citations·filing 1987–2017
97Inventor score
Top patents by PatentIndex Score
18 records- 0196US5173442AMethods of forming channels and vias in insulating layersMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 22, 1992·299 cites·8 claims
- 0295US4926241AFlip substrate for chip mountMICROELECTRONICS & COMPUTER·Filed 1988·Granted May 15, 1990·164 cites·18 claims
- 0394US5379191ACompact adapter package providing peripheral to area translation for an integrated circuit chipMICROELECTRONICS & COMPUTER·Filed 1994·Granted Jan 3, 1995·185 cites·8 claims
- 0493US5289346APeripheral to area adapter with protective bumper for an integrated circuit chipMICROELECTRONICS & COMPUTER·Filed 1993·Granted Feb 22, 1994·183 cites·26 claims
- 0593US5091339ATrenching techniques for forming vias and channels in multilayer electrical interconnectsMICROELECTRONICS & COMPUTER·Filed 1990·Granted Feb 25, 1992·189 cites·49 claims
- 0692US5101553AMethod of making a metal-on-elastomer pressure contact connectorMICROELECTRONICS & COMPUTER·Filed 1991·Granted Apr 7, 1992·82 cites·36 claims
- 0789US5272600AElectrical interconnect device with interwoven power and ground lines and capacitive viasMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 21, 1993·115 cites·23 claims
- 0889US5219787ATrenching techniques for forming channels, vias and components in substratesMICROELECTRONICS & COMPUTER·Filed 1992·Granted Jun 15, 1993·179 cites·33 claims
- 0987US5132878ACustomizable circuitryMICROELECTRONICS & COMPUTER·Filed 1989·Granted Jul 21, 1992·79 cites·14 claims
- 1086US5284548AProcess for producing electrical circuits with precision surface featuresMICROELECTRONICS & COMPUTER·Filed 1993·Granted Feb 8, 1994·79 cites·41 claims
- 1185US5039628AFlip substrate for chip mountMICROELECTRONICS & COMPUTER·Filed 1990·Granted Aug 13, 1991·90 cites·18 claims
- 1283US5438166ACustomizable circuitryMICROELECTRONICS & COMPUTER·Filed 1992·Granted Aug 1, 1995·66 cites·12 claims
- 1381US5049979ACombined flat capacitor and tab integrated circuit chip and methodMICROELECTRONICS & COMPUTER·Filed 1990·Granted Sep 17, 1991·68 cites·19 claims
- 1479US5240671AMethod of forming recessed patterns in insulating substratesMICROELECTRONICS & COMPUTER·Filed 1992·Granted Aug 31, 1993·58 cites·55 claims
- 1575US5165166AMethod of making a customizable circuitryMICROELECTRONICS & COMPUTER·Filed 1991·Granted Nov 24, 1992·44 cites·19 claims
- 1668US4829242AMultigigahertz probeMICROELECTRONICS & COMPUTER·Filed 1987·Granted May 9, 1989·28 cites·8 claims
- 1751US5216803AMethod and apparatus for removing bonded connectionsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Jun 8, 1993·21 cites·11 claims
- 1836US2019165342A1Thin-film battery with adhesive layerITN ENERGY SYSTEMS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →