Inventor · disambiguated record
Sam Lee
Also filed as: LEE SAM · LEE SAM K · LEE SAM KEUN
11 granted patents·7 pending applications·74 citations·filing 1993–2024
86Inventor score
Files withAPPLIED MATERIALS INC11HITCO CARBON COMPOSITES INC4MICROCHEM INC1NAM CHUNG CO LTD1SGL CARBON COMPOSITES INC1
Top patents by PatentIndex Score
18 records- 0176US5759688ASilicon carbide fiber reinforced carbon compositesSGL CARBON COMPOSITES INC·Filed 1993·Granted Jun 2, 1998·33 cites·58 claims
- 0275US2025051951A1Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0370US11788200B2Fluid recovery in semiconductor processingAPPLIED MATERIALS INC·Filed 2022·Granted Oct 17, 2023·0 cites·21 claims
- 0469US2019345624A1Systems and methods for removing contaminants in electroplating systemsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 0567US12146235B2Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0665US6255234B1Ultra low friction carbon/carbon composites for extreme temperature applicationsHITCO CARBON COMPOSITES INC·Filed 1998·Granted Jul 3, 2001·20 cites·32 claims
- 0764US6226866B1Method of making carbon-carbon composite valve for high performance internal combustion enginesHITCO CARBON COMPOSITES INC·Filed 2000·Granted May 8, 2001·10 cites·11 claims
- 0859US11352711B2Fluid recovery in semiconductor processingAPPLIED MATERIALS INC·Filed 2019·Granted Jun 7, 2022·0 cites·18 claims
- 0953US2023411222A1Model-based parameter adjustments for deposition processesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1052US6085714ACarbon--carbon composite valve for high performance internal combustion enginesHITCO CARBON COMPOSITES INC·Filed 1998·Granted Jul 11, 2000·11 cites·39 claims
- 1150US10618925B2Tungsten precursorMICROCHEM INC·Filed 2016·Granted Apr 14, 2020·0 cites·11 claims
- 1250US2014262804A1Electroplating processor with wafer heating or coolingAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 1349US2008299406A1Split Leather for Car Seats and Manufacturing Method ThereofNAM CHUNG CO LTD·Filed 2008·Application pending·0 cites
- 1446US11814744B2Substrate cleaning components and methods in a plating systemAPPLIED MATERIALS INC·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 1542US9758893B2Electroplating methods for semiconductor substratesAPPLIED MATERIALS INC·Filed 2014·Granted Sep 12, 2017·0 cites·15 claims
- 1642US2007128421A1Refractory compositeHITCO CARBON COMPOSITES INC·Filed 2006·Application pending·0 cites
- 1738US2016333492A1Methods for increasing the rate of electrochemical depositionAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 1835US9922874B2Methods of enhancing polymer adhesion to copperAPPLIED MATERIALS INC·Filed 2016·Granted Mar 20, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →