Inventor · disambiguated record
Charles Sharbono
Also filed as: SHARBONO CHARLES
7 granted patents·6 pending applications·0 citations·filing 2013–2025
68Inventor score
Files withAPPLIED MATERIALS INC13
Top patents by PatentIndex Score
13 records- 0175US2025347020A1Electroplating co-planarity improvement by die shieldingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0275US2025051951A1Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0367US12146235B2Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0467US2023272546A1Electroplating systems and methods with increased metal ion concentrationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0566US11686005B1Electroplating systems and methods with increased metal ion concentrationsAPPLIED MATERIALS INC·Filed 2022·Granted Jun 27, 2023·0 cites·13 claims
- 0665US12344955B2Electroplating co-planarity improvement by die shieldingAPPLIED MATERIALS INC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 0765US2025198041A1Controlled ph rinse to limit cross-contamination in electroplating bathsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0858US11697887B2Multi-compartment electrochemical replenishment cellAPPLIED MATERIALS INC·Filed 2020·Granted Jul 11, 2023·0 cites·20 claims
- 0947US10840104B2Controlled etch of nitride featuresAPPLIED MATERIALS INC·Filed 2018·Granted Nov 17, 2020·0 cites·19 claims
- 1042US9758893B2Electroplating methods for semiconductor substratesAPPLIED MATERIALS INC·Filed 2014·Granted Sep 12, 2017·0 cites·15 claims
- 1140US2014262794A1Electrochemical deposition processes for semiconductor wafersAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 1238US2016333492A1Methods for increasing the rate of electrochemical depositionAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 1335US9922874B2Methods of enhancing polymer adhesion to copperAPPLIED MATERIALS INC·Filed 2016·Granted Mar 20, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →