Inventor · disambiguated record
Chie Iino
Also filed as: IINO CHIE
4 granted patents·7 pending applications·4 citations·filing 2014–2016
61Inventor score
Files withNITTO DENKO CORP11
Top patents by PatentIndex Score
11 records- 0180US9659883B2Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor packageNITTO DENKO CORP·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 0267US9754894B2Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealingNITTO DENKO CORP·Filed 2014·Granted Sep 5, 2017·2 cites·3 claims
- 0346US10128131B2Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Nov 13, 2018·0 cites·4 claims
- 0443US2018304603A1Bump base reinforcement sheetNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 0542US2017125373A1Method for producing semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0642US2017033076A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0742US2017032979A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0841US2017040287A1Electronic component device production method and electronic component sealing sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0941US2017040187A1Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1038US10074582B2Sealing sheetNITTO DENKO CORP·Filed 2015·Granted Sep 11, 2018·0 cites·1 claims
- 1132US2017278716A1Sealing sheet, sealing sheet with separator, semiconductor device, and production method for semiconductor deviceNITTO DENKO CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →