Inventor · disambiguated record
Tsuyoshi Ishizaka
Also filed as: ISHIZAKA TSUYOSHI
4 granted patents·6 pending applications·3 citations·filing 2004–2015
59Inventor score
Files withNITTO DENKO CORP10
Top patents by PatentIndex Score
10 records- 0180US9659883B2Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor packageNITTO DENKO CORP·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 0261US10301509B2Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tapeNITTO DENKO CORP·Filed 2015·Granted May 28, 2019·1 cites·3 claims
- 0346US10128131B2Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Nov 13, 2018·0 cites·4 claims
- 0442US2017125373A1Method for producing semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0542US2017033076A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0642US2017032979A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0741US2017040287A1Electronic component device production method and electronic component sealing sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0841US2017040187A1Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0937US7268191B2Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained therebyNITTO DENKO CORP·Filed 2004·Granted Sep 11, 2007·0 cites·2 claims
- 1033US2010308477A1Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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