Inventor · disambiguated record
Chun-I Fan
Also filed as: FAN CHUN-I
9 granted patents·4 pending applications·5 citations·filing 2013–2025
77Inventor score
Top patents by PatentIndex Score
13 records- 0184US10475637B2Semiconductor substrate and manufacturing method thereofGLOBALWAFERS CO LTD·Filed 2017·Granted Nov 12, 2019·4 cites·4 claims
- 0278US2025372422A1Method of processing waferGLOBALWAFERS CO LTD·Filed 2025·Application pending·0 cites
- 0367US10608078B2Bonded substrate for epitaxial growth and method of forming the sameGLOBALWAFERS CO LTD·Filed 2018·Granted Mar 31, 2020·1 cites·10 claims
- 0465US11688628B2Method of manufacturing epitaxy substrateGLOBALWAFERS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·15 claims
- 0565US2023282472A1Wafer and method of processing waferGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 0656US11201080B2Epitaxy substrate and method of manufacturing the sameGLOBALWAFERS CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·14 claims
- 0750US11538681B2Epitaxy substrate and method of manufacturing the sameGLOBALWAFERS CO LTD·Filed 2019·Granted Dec 27, 2022·0 cites·7 claims
- 0846US10388518B2Epitaxial substrate and method of manufacturing the sameGLOBALWAFERS CO LTD·Filed 2018·Granted Aug 20, 2019·0 cites·6 claims
- 0944US10103108B2Nanostructured chip and method of producing the sameGLOBALWAFERS CO LTD·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
- 1039US2016056034A1Method for manufacturing a waferSINO AMERICAN SILICON PROD INC·Filed 2015·Application pending·0 cites
- 1138US9885125B2Method for manufacturing isolating layer onto crucible and spraying device related theretoSINO AMERICAN SILICON PROD INC·Filed 2015·Granted Feb 6, 2018·0 cites·7 claims
- 1237US8972734B2Symmetric dynamic authentication and key exchange system and method thereofUNIV NAT SUN YAT SEN·Filed 2013·Granted Mar 3, 2015·0 cites·9 claims
- 1332US2018144962A1Wafer susceptorGLOBALWAFERS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →