Inventor · disambiguated record
Ju-Wang Hsu
Also filed as: HSU JU-WANG
27 granted patents·5 pending applications·674 citations·filing 2001–2019
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG27TAIWAN SEMICONDUCTOR MFG CO LTD2HSU JU-WANG1HUANG YI-CHUN1TAIWAN SEMICONDUCTOR MANFACTUR1
Top patents by PatentIndex Score
32 records- 0198US7425740B2Method and structure for a 1T-RAM bit cell and macroTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 16, 2008·278 cites·26 claims
- 0295US7052946B2Method for selectively stressing MOSFETs to improve charge carrier mobilityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 30, 2006·84 cites·36 claims
- 0393US7259050B2Semiconductor device and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 21, 2007·75 cites·25 claims
- 0487US6498067B1Integrated approach for controlling top dielectric loss during spacer etchingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 24, 2002·51 cites·26 claims
- 0586US7256498B2Resistance-reduced semiconductor device and methods for fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 14, 2007·14 cites·8 claims
- 0681US7230270B2Self-aligned double gate device and method for forming sameTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2004·Granted Jun 12, 2007·27 cites·28 claims
- 0781US7223647B2Method for forming integrated advanced semiconductor device using sacrificial stress layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 29, 2007·28 cites·15 claims
- 0879US6884736B2Method of forming contact plug on silicide structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 26, 2005·20 cites·43 claims
- 0978US8927353B2Fin field effect transistor and method of forming the sameHSU JU-WANG·Filed 2007·Granted Jan 6, 2015·8 cites·17 claims
- 1077US7008878B2Plasma treatment and etching process for ultra-thin dielectric filmsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 7, 2006·18 cites·17 claims
- 1174US6787455B2Bi-layer photoresist method for forming high resolution semiconductor featuresTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 7, 2004·16 cites·20 claims
- 1272US7271448B2Multiple gate field effect transistor structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 18, 2007·5 cites·40 claims
- 1372US7265060B2Bi-level resist structure and fabrication method for contact holes on semiconductor substratesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 4, 2007·12 cites·28 claims
- 1470US7378308B2CMOS devices with improved gap-fillingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 27, 2008·4 cites·12 claims
- 1568US10483397B2Fin field effect transistor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 19, 2019·1 cites·20 claims
- 1668US6706640B1Metal silicide etch resistant plasma etch methodTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 16, 2004·11 cites·20 claims
- 1764US11355642B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 1864US7256137B2Method of forming contact plug on silicide structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 14, 2007·1 cites·19 claims
- 1963US6780782B1Bi-level resist structure and fabrication method for contact holes on semiconductor substratesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 24, 2004·7 cites·6 claims
- 2061US6838381B2Methods for improving sheet resistance of silicide layer after removal of etch stop layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 4, 2005·11 cites·25 claims
- 2159US8030214B2Method of fabricating gate structuresTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 4, 2011·2 cites·20 claims
- 2256US7678655B2Spacer layer etch method providing enhanced microelectronic device performanceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 16, 2010·1 cites·20 claims
- 2347US2006223255A1Method for selectively stressing MOSFETs to improve charge carrier mobilityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2447US2006183279A1Method for selectively stressing mosfets to improve charge carrier mobilityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2545US7400401B2Measuring low dielectric constant film properties during processingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jul 15, 2008·0 cites·17 claims
- 2643US7875547B2Contact hole structures and contact structures and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 25, 2011·0 cites·14 claims
- 2742US2008122107A1Poly silicon hard maskTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2841US7341935B2Alternative interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 11, 2008·0 cites·25 claims
- 2941US7316970B2Method for forming high selectivity protection layer on semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 8, 2008·0 cites·23 claims
- 3037US2006148157A1Geometrically optimized spacer to improve device performanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3135US2005212058A1Resistance-reduced semiconductor device and fabrication thereofHUANG YI-CHUN·Filed 2004·Application pending·0 cites
- 3233US7179701B2Transistor with high dielectric constant gate and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Feb 20, 2007·0 cites·14 claims
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