Inventor · disambiguated record
Tsuyoshi Tamaru
Also filed as: TAMARU TSUYOSHI
56 granted patents·8 pending applications·1,018 citations·filing 1990–2021
99Inventor score
Files withHITACHI LTD24RENESAS TECH CORP12RENESAS ELECTRONICS CORP11KONICA MINOLTA INC4TEXAS INSTRUMENTS INC3
Top patents by PatentIndex Score
64 records- 0193US9064870B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·7 cites·15 claims
- 0293US6028360ASemiconductor integrated circuit device in which a conductive film is formed over a trap film which in turn is formed over a titanium filmHITACHI LTD·Filed 1998·Granted Feb 22, 2000·101 cites·2 claims
- 0392US6818546B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Nov 16, 2004·50 cites·35 claims
- 0491US6908847B2Method of manufacturing a semiconductor device having an interconnect embedded in an insulating filmRENESAS TECH CORP·Filed 2002·Granted Jun 21, 2005·46 cites·17 claims
- 0591US6258649B1Semiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Jul 10, 2001·91 cites·11 claims
- 0690US7323781B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Granted Jan 29, 2008·30 cites·24 claims
- 0790US6096597AMethod for fabricating an integrated circuit structureTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 1, 2000·86 cites·13 claims
- 0889US9659867B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·4 claims
- 0988US8617981B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 31, 2013·4 cites·12 claims
- 1088US6215144B1Semiconductor integrated circuit device, and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Apr 10, 2001·73 cites·19 claims
- 1187US8431480B2Semiconductor device and manufacturing method thereofNOGUCHI JUNJI·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 1287US8012871B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 6, 2011·7 cites·5 claims
- 1387US7642652B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jan 5, 2010·9 cites·21 claims
- 1487US6399438B2Method of manufacturing semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2001·Granted Jun 4, 2002·32 cites·17 claims
- 1586US7723849B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted May 25, 2010·9 cites·13 claims
- 1684US8053893B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·6 cites·14 claims
- 1783US5202275ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·43 cites·23 claims
- 1880US7053487B2Semiconductor deviceRENESASTECHNOLOGY CORP·Filed 2002·Granted May 30, 2006·24 cites·37 claims
- 1980US5498768AProcess for forming multilayer wiringHITACHI LTD·Filed 1993·Granted Mar 12, 1996·60 cites·18 claims
- 2079US5780882ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1995·Granted Jul 14, 1998·33 cites·8 claims
- 2177US8810034B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 19, 2014·1 cites·9 claims
- 2276US7282434B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Oct 16, 2007·4 cites·11 claims
- 2376US6548847B2Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal filmHITACHI LTD·Filed 2001·Granted Apr 15, 2003·12 cites·33 claims
- 2476US6329681B1Semiconductor integrated circuit device and method of manufacturing the sameFiled 1998·Granted Dec 11, 2001·38 cites·18 claims
- 2575US10304726B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·0 cites·11 claims
- 2675US6856019B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 15, 2005·14 cites·9 claims
- 2775US6605530B2Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2002·Granted Aug 12, 2003·14 cites·24 claims
- 2875US2019244855A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 2973US7777343B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Aug 17, 2010·2 cites·6 claims
- 3073US5331191ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Jul 19, 1994·24 cites·11 claims
- 3172US10121693B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 3271US7321171B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jan 22, 2008·10 cites·18 claims
- 3371US6853081B2Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2003·Granted Feb 8, 2005·11 cites·18 claims
- 3470US9818639B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 14, 2017·0 cites·4 claims
- 3568US6638811B2Method of manufacturing a semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2002·Granted Oct 28, 2003·9 cites·8 claims
- 3667US5670421AProcess for forming multilayer wiringHITACHI LTD·Filed 1996·Granted Sep 23, 1997·31 cites·9 claims
- 3766US9490213B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
- 3865US6686619B2Dynamic random access memory with improved contact arrangementsHITACHI LTD·Filed 2002·Granted Feb 3, 2004·7 cites·4 claims
- 3964US7176121B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2003·Granted Feb 13, 2007·12 cites·1 claims
- 4062US6894334B2Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI VLSI ENG·Filed 2003·Granted May 17, 2005·5 cites·33 claims
- 4161US6169324B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 2, 2001·13 cites·19 claims
- 4261US5739589ASemiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Apr 14, 1998·13 cites·21 claims
- 4357US6103566AMethod for manufacturing semiconductor integrated circuit device having a titanium electrodeHITACHI LTD·Filed 1996·Granted Aug 15, 2000·22 cites·18 claims
- 4456US6492730B1Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2000·Granted Dec 10, 2002·4 cites·10 claims
- 4554US6730613B1Method for reducing by-product deposition in wafer processing equipmentTEXAS INSTRUMENTS INC·Filed 1999·Granted May 4, 2004·17 cites·13 claims
- 4651US6767782B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Jul 27, 2004·5 cites·18 claims
- 4751US6342412B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 29, 2002·8 cites·19 claims
- 4850US7119443B2Semiconductor integrated circuit device having a conductive film which contains metal atoms bondable to a halogen elementHITACHI LTD·Filed 2004·Granted Oct 10, 2006·2 cites·5 claims
- 4950US7078815B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2005·Granted Jul 18, 2006·0 cites·14 claims
- 5050US6127255ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Oct 3, 2000·8 cites·12 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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