Inventor · disambiguated record
Kenji Takai
Also filed as: TAKAI KENJI
31 granted patents·24 pending applications·113 citations·filing 2000–2024
95Inventor score
Files withHITACHI CHEMICAL CO LTD19SAMSUNG ELECTRONICS CO LTD15KYOCERA DOCUMENT SOLUTIONS INC11TAKAI KENJI5SHARP KK4
Top patents by PatentIndex Score
55 records- 0193US10316424B2Flexible electrically conductive structure, flexible wiring board, production method thereof, and electronic device includng the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·24 claims
- 0288US11254840B2Polishing slurry and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·2 cites·25 claims
- 0387US7168248B2Stirling engineSHARP KK·Filed 2004·Granted Jan 30, 2007·42 cites·3 claims
- 0481US11424133B2Metal structure and method of manufacturing the same and metal wire and semiconductor device and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·9 claims
- 0581US11021804B2Plating solution and metal composite and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 1, 2021·1 cites·6 claims
- 0680US7740936B2Adhesion assisting agent fitted metal foil, and printed wiring board using thereofHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 22, 2010·11 cites·24 claims
- 0779US9019515B2Display input device having a program function, image forming apparatus having a program function, and display method for display input device having a program functionTAKAI KENJI·Filed 2011·Granted Apr 28, 2015·3 cites·14 claims
- 0879US7964289B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jun 21, 2011·5 cites·21 claims
- 0975US10585577B2Display device and computer-readable non-transitory recording medium recording display control programKYOCERA DOCUMENT SOLUTIONS INC·Filed 2017·Granted Mar 10, 2020·2 cites·8 claims
- 1072US11795347B2Polishing slurry and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1171US7473458B2Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jan 6, 2009·11 cites·28 claims
- 1270US7615277B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 10, 2009·10 cites·18 claims
- 1367US2021222311A1Plating solution and metal composite and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1466US6474075B1Regenerator for a stirling cycle based systemSHARP KK·Filed 2000·Granted Nov 5, 2002·13 cites·2 claims
- 1562US9667623B2Authentication apparatus that assists input of user ID and password authentication method, and recording mediumKYOCERA DOCUMENT SOLUTIONS INC·Filed 2015·Granted May 30, 2017·1 cites·8 claims
- 1662US7955689B2Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 7, 2011·2 cites·12 claims
- 1762US7629045B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted Dec 8, 2009·2 cites·19 claims
- 1862US2008138505A1Formation method of metal layer on resin layer, printed wiring board, and production method thereofTAKAI KENJI·Filed 2008·Application pending·0 cites
- 1959US2025028492A1Information processing apparatus including rotatable display device, and image forming apparatusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 2058US7775041B2Stirling engineSHARP KK·Filed 2006·Granted Aug 17, 2010·2 cites·2 claims
- 2158US7749605B2Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jul 6, 2010·1 cites·26 claims
- 2258US7749612B2Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jul 6, 2010·1 cites·12 claims
- 2358US2018021708A1Biomolecule capturing filterHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2456US10957557B2Polishing slurry and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·18 claims
- 2556US2014299539A1Biomolecule capturing filterHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 2654US10961414B2Polishing slurry, method of manufacturing the same, and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·15 claims
- 2754US10829690B2Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 2854US8815334B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardTAKAI KENJI·Filed 2009·Granted Aug 26, 2014·0 cites·7 claims
- 2954US7818877B2Formation method of metal layer on resin layerHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 26, 2010·0 cites·12 claims
- 3054US2025039314A1Information processing apparatus that displays preview image on display device, and image forming apparatusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3154US2025029539A1Information processing apparatus and image forming apparatus that perform display control for display deviceKYOCERA DOCUMENT SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3253US7862889B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 4, 2011·0 cites·18 claims
- 3351US2007034277A1FabricDAIICHI ORIMONO KK·Filed 2006·Application pending·0 cites
- 3450US9232095B2Display input device, image forming apparatus, and control method of display input deviceKYOCERA DOCUMENT SOLUTIONS INC·Filed 2014·Granted Jan 5, 2016·0 cites·19 claims
- 3550US2025030804A1Information processing apparatus and image forming apparatus capable of display control of their display deviceKYOCERA DOCUMENT SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3649US2010327237A1Conductive particle and method for producing conductive particleHITACHI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 3748US9380178B2Display input apparatus, image forming apparatus having the same, and method for controlling the display input apparatusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2014·Granted Jun 28, 2016·0 cites·10 claims
- 3848US2010133486A1Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive filmHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 3947US2016169781A1Cell-trapping systemHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 4046US11811987B2Operation input device and image forming apparatusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2022·Granted Nov 7, 2023·0 cites·9 claims
- 4146US2021071035A1Carbon abrasive and polishing slurry and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4245US2021035812A1Chemical mechanical polishing method and chemical mechanical polishing device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4345US2021147712A1Polishing slurry and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4444US9336464B2Operation device and operation method for showing preview images reflecting changed settingsKYOCERA DOCUMENT SOLUTIONS INC·Filed 2013·Granted May 10, 2016·0 cites·4 claims
- 4544US2019382618A1Hydroxyl fullerene dispersion, method of preparing the same, polishing slurry including the same, and method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4642US2021147713A1Polishing slurry and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4741US2021066086A1Chemical mechanical polishing method and method of manufacturing semiconductor device and polishing pad and chemical mechanical polishing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4839US2012104333A1Coated conductive particles and method for producing sameTAKAI KENJI·Filed 2010·Application pending·0 cites
- 4938US8873075B2Operation device, image forming apparatus, and operation method storing orientation setting informationTAKAI KENJI·Filed 2011·Granted Oct 28, 2014·0 cites·18 claims
- 5037US2007089410A1Stirling engineSHARP KK·Filed 2004·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →