Inventor · disambiguated record
Taebok Jung
Also filed as: JUNG TAEBOK
4 granted patents·48 citations·filing 2005–2007
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0185US7208821B2Multichip leadframe packageCHIPPAC INC·Filed 2005·Granted Apr 24, 2007·19 cites·22 claims
- 0283US7436048B2Multichip leadframe packageCHIPPAC INC·Filed 2007·Granted Oct 14, 2008·15 cites·22 claims
- 0380US7279785B2Stacked die package systemSTATS CHIPPAC LTD·Filed 2005·Granted Oct 9, 2007·9 cites·16 claims
- 0473US7674640B2Stacked die package systemSTATS CHIPPAC LTD·Filed 2007·Granted Mar 9, 2010·5 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →