Inventor · disambiguated record
Hirokazu Ezawa
Also filed as: EZAWA HIROKAZU
37 granted patents·10 pending applications·1,082 citations·filing 1990–2016
98Inventor score
Top patents by PatentIndex Score
47 records- 0198US9396998B2Semiconductor device having fan-in and fan-out redistribution layersTOSHIBA KK·Filed 2014·Granted Jul 19, 2016·62 cites·21 claims
- 0296US6798050B1Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the sameTOSHIBA KK·Filed 2000·Granted Sep 28, 2004·133 cites·6 claims
- 0394US6661088B1Semiconductor integrated circuit device having interposer and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Dec 9, 2003·81 cites·24 claims
- 0493US5480839ASemiconductor device manufacturing methodTOSHIBA KK·Filed 1994·Granted Jan 2, 1996·133 cites·7 claims
- 0592US7399706B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2005·Granted Jul 15, 2008·25 cites·10 claims
- 0689US6734568B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted May 11, 2004·55 cites·22 claims
- 0788US6569752B1Semiconductor element and fabricating method thereofTOSHIBA KK·Filed 2000·Granted May 27, 2003·56 cites·46 claims
- 0886US7638439B2Peripheral processing method and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2006·Granted Dec 29, 2009·12 cites·17 claims
- 0985US8703600B2Electronic component and method of connecting with multi-profile bumpsMIGITA TATSUO·Filed 2010·Granted Apr 22, 2014·10 cites·5 claims
- 1085US8314491B2Manufacturing method of semiconductor device and semiconductor deviceYAMASHITA SOICHI·Filed 2010·Granted Nov 20, 2012·13 cites·5 claims
- 1185US5587337ASemiconductor process for forming bump electrodes with tapered sidewallsTOSHIBA KK·Filed 1995·Granted Dec 24, 1996·81 cites·4 claims
- 1284US7238919B2Heating element movement bonding method for semiconductor componentsTOSHIBA KK·Filed 2006·Granted Jul 3, 2007·13 cites·13 claims
- 1381US5473197ASemiconductor device having bump electrodes with a trapezoidal cross-section along one axisTOSHIBA KK·Filed 1994·Granted Dec 5, 1995·44 cites·5 claims
- 1480US6706422B2Electroless Ni—B plating liquid, electronic device and method for manufacturing the sameEBARA CORP·Filed 2001·Granted Mar 16, 2004·16 cites·7 claims
- 1579US6407453B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Jun 18, 2002·32 cites·14 claims
- 1676US9190373B2Bump structure with underbump metallization structure and integrated redistribution layerMIGITA TATSUO·Filed 2011·Granted Nov 17, 2015·5 cites·12 claims
- 1776US7473628B2Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2006·Granted Jan 6, 2009·7 cites·11 claims
- 1874US6605522B1Method of manufacturing a semiconductor device having a protruding bump electrodeTOSHIBA KK·Filed 2000·Granted Aug 12, 2003·18 cites·9 claims
- 1974US5885891AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1997·Granted Mar 23, 1999·46 cites·23 claims
- 2073US7531876B2Semiconductor device having power semiconductor elementsTOSHIBA KK·Filed 2005·Granted May 12, 2009·6 cites·14 claims
- 2173US6404051B1Semiconductor device having a protruding bump electrodeTOSHIBA KK·Filed 1995·Granted Jun 11, 2002·40 cites·12 claims
- 2270US9287225B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2014·Granted Mar 15, 2016·2 cites·21 claims
- 2369US5705230AMethod for filling small holes or covering small recesses in the surface of substratesEBARA CORP·Filed 1994·Granted Jan 6, 1998·43 cites·3 claims
- 2468US8704367B2Semiconductor device and manufacturing method of semiconductor deviceMIGITA TATSUO·Filed 2011·Granted Apr 22, 2014·4 cites·11 claims
- 2567US8232197B2Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removedHONDA MAKOTO·Filed 2009·Granted Jul 31, 2012·2 cites·10 claims
- 2667US7605076B2Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removedTOSHIBA KK·Filed 2006·Granted Oct 20, 2009·2 cites·10 claims
- 2766US5529634AApparatus and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jun 25, 1996·39 cites·6 claims
- 2858US6936302B2Electroless Ni-B plating liquid, electronic device and method for manufacturing the sameTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·2 cites·6 claims
- 2958US5656542AMethod for manufacturing wiring in grooveTOSHIBA KK·Filed 1995·Granted Aug 12, 1997·25 cites·10 claims
- 3054US5136363ASemiconductor device with bump electrodeTOSHIBA KK·Filed 1990·Granted Aug 4, 1992·23 cites·7 claims
- 3152US8063487B2Manufacturing method of semiconductor apparatus and semiconductor apparatusMIGITA TATSUO·Filed 2008·Granted Nov 22, 2011·0 cites·9 claims
- 3250US9673147B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2016·Granted Jun 6, 2017·0 cites·19 claims
- 3350US2008272494A1Semiconductor deviceTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3449US2009134516A1Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3548US5992725AApparatus and method for producing electronic elementsTOSHIBA KK·Filed 1997·Granted Nov 30, 1999·15 cites·8 claims
- 3648US5057453AMethod for making a semiconductor bump electrode with a skirtTOSHIBA KK·Filed 1990·Granted Oct 15, 1991·17 cites·9 claims
- 3746US8569181B2Manufacturing method of semiconductor apparatus and semiconductor apparatusMIGITA TATSUO·Filed 2011·Granted Oct 29, 2013·0 cites·9 claims
- 3843USRE37882ESemiconductor device manufacturing methodTOSHIBA KK·Filed 1997·Granted Oct 15, 2002·9 cites·33 claims
- 3941US5500559ASemiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 1994·Granted Mar 19, 1996·11 cites·5 claims
- 4041US2006055050A1Semiconductor device and manufacturing method thereofNUMATA HIDEO·Filed 2005·Application pending·0 cites
- 4140US2006102290A1Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor deviceHARADA SUSUMU·Filed 2005·Application pending·0 cites
- 4240US2004238955A1Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4338US2012068334A1Semiconductor device and manufacturing method thereofMIGITA TATSUO·Filed 2011·Application pending·0 cites
- 4438US2004251550A1Semiconductor device and method of manufacturing the sameFiled 2003·Application pending·0 cites
- 4538US2012049367A1Semiconductor device and manufacturing method of semiconductor deviceMIGITA TATSUO·Filed 2011·Application pending·0 cites
- 4636US2011049707A1Semiconductor device and method of manufacturing the semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 4733US2002140099A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2002·Application pending·0 cites
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