Inventor · disambiguated record
Fu Tang
Also filed as: TANG FU · TANG FU-DI
42 granted patents·23 pending applications·2,810 citations·filing 2001–2025
98Inventor score
Files withASM IP HOLDING BV42SILICONWARE PRECISION INDUSTRIES CO LTD17TSAI YUEH-YING2HUANG CHIEN-PING1LIN PANG-CHUN1
Top patents by PatentIndex Score
65 records- 0198US9905492B2System and method for gas-phase passivation of a semiconductor surfaceASM IP HOLDING BV·Filed 2017·Granted Feb 27, 2018·361 cites·10 claims
- 0298US9558931B2System and method for gas-phase sulfur passivation of a semiconductor surfaceASM IP HOLDING BV·Filed 2013·Granted Jan 31, 2017·478 cites·14 claims
- 0398US9245742B2Sulfur-containing thin filmsASM IP HOLDING BV·Filed 2013·Granted Jan 26, 2016·476 cites·12 claims
- 0497US10410943B2Method for passivating a surface of a semiconductor and related systemsASM IP HOLDING BV·Filed 2017·Granted Sep 10, 2019·339 cites·19 claims
- 0597US10367080B2Method of forming a germanium oxynitride filmASM IP HOLDING BV·Filed 2016·Granted Jul 30, 2019·375 cites·20 claims
- 0697US9911676B2System and method for gas-phase passivation of a semiconductor surfaceASM IP HOLDING BV·Filed 2017·Granted Mar 6, 2018·464 cites·20 claims
- 0795US7314820B2Carrier-free semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Jan 1, 2008·74 cites·18 claims
- 0894US9461134B1Method for forming source/drain contact structure with chalcogen passivationASM IP HOLDING BV·Filed 2015·Granted Oct 4, 2016·12 cites·23 claims
- 0993US11798999B2Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structuresASM IP HOLDING BV·Filed 2022·Granted Oct 24, 2023·1 cites·20 claims
- 1093US7679172B2Semiconductor package without chip carrier and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Mar 16, 2010·33 cites·27 claims
- 1190US9711396B2Method for forming metal chalcogenide thin films on a semiconductor deviceASM IP HOLDING BV·Filed 2015·Granted Jul 18, 2017·7 cites·20 claims
- 1289US6696752B2Encapsulated semiconductor device with flash-proof structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Feb 24, 2004·97 cites·19 claims
- 1387US9478419B2Sulfur-containing thin filmsASM IP HOLDING BV·Filed 2013·Granted Oct 25, 2016·7 cites·19 claims
- 1487US7893547B2Semiconductor package with a support structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Feb 22, 2011·13 cites·4 claims
- 1586US9741815B2Metal selenide and metal telluride thin films for semiconductor device applicationsASM IP HOLDING BV·Filed 2015·Granted Aug 22, 2017·5 cites·23 claims
- 1684US12295163B2Formation of gate stacks comprising a threshold voltage tuning layerASM IP HOLDING BV·Filed 2022·Granted May 6, 2025·1 cites·15 claims
- 1784US12094936B2Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structuresASM IP HOLDING BV·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1884US10199213B2Sulfur-containing thin filmsASM IP HOLDING BV·Filed 2017·Granted Feb 5, 2019·2 cites·20 claims
- 1983US6396129B1Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 28, 2002·36 cites·7 claims
- 2081US11101370B2Method of forming a germanium oxynitride filmASM IP HOLDING BV·Filed 2019·Granted Aug 24, 2021·2 cites·20 claims
- 2178US11923192B2Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structuresASM IP HOLDING BV·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 2277US9177837B2Fabrication method of semiconductor package having electrical connecting structuresSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 3, 2015·3 cites·13 claims
- 2373US11411088B2Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structuresASM IP HOLDING BV·Filed 2020·Granted Aug 9, 2022·0 cites·8 claims
- 2472US10854444B2Sulfur-containing thin filmsASM IP HOLDING BV·Filed 2020·Granted Dec 1, 2020·0 cites·19 claims
- 2571US2025313953A1Methods and systems for forming doped silicon nitride filmsASM IP HOLDING BV·Filed 2025·Application pending·0 cites
- 2670US9190296B2Fabrication method of semiconductor package without chip carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 17, 2015·2 cites·18 claims
- 2769US8390118B2Semiconductor package having electrical connecting structures and fabrication method thereofLIN PANG-CHUN·Filed 2010·Granted Mar 5, 2013·2 cites·9 claims
- 2866US11289409B2Method for fabricating carrier-free semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·12 claims
- 2966US2024229233A1Layer deposition with post-deposition agglomeration mitigationASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 3065US10553424B2Sulfur-containing thin filmsASM IP HOLDING BV·Filed 2019·Granted Feb 4, 2020·0 cites·20 claims
- 3164US12378667B2Methods and systems for forming doped silicon nitride filmsASM IP HOLDING BV·Filed 2022·Granted Aug 5, 2025·0 cites·21 claims
- 3264US10818758B2Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structuresASM IP HOLDING BV·Filed 2018·Granted Oct 27, 2020·0 cites·19 claims
- 3363US8241967B2Semiconductor package with a support structure and fabrication method thereofHUANG CHIEN-PING·Filed 2011·Granted Aug 14, 2012·1 cites·8 claims
- 3463US2025218783A1Method, system and apparatus for forming a threshold voltage shifting layerASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 3562US11469098B2Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structuresASM IP HOLDING BV·Filed 2019·Granted Oct 11, 2022·0 cites·28 claims
- 3662US8975734B2Semiconductor package without chip carrier and fabrication method thereofTSAI YUEH-YING·Filed 2010·Granted Mar 10, 2015·2 cites·19 claims
- 3762US2025043422A1Method, system and apparatus for treating substrate surfaceASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 3861US6696750B1Semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 24, 2004·13 cites·11 claims
- 3961US2025034701A1Method, system and apparatus for forming metal oxide layersASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 4060US2025105012A1Metal and carbon containing layers, including methods and systems for their manufactureASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 4159US2025273558A1Methods for forming asymmetrical dipoles for capacitors, related devices, and related systemsASM IP HOLDING BV·Filed 2025·Application pending·0 cites
- 4258US9721786B2Sulfur-containing thin filmsASM IP HOLDING BV·Filed 2016·Granted Aug 1, 2017·0 cites·17 claims
- 4358US2025079160A1Gapfill method, system and apparatusASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 4458US2024234129A1Methods and systems for forming structures comprising a threshold voltage tuning layerASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 4558US2024072104A1Method and systems for forming device structures including high-k dielectric layers and related device structuresASM IP HOLDING BV·Filed 2023·Application pending·0 cites
- 4656US2025101579A1Methods for forming a doped hafnium zirconium oxide layer on a substrateASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 4756US2025369110A1Method for forming a semiconductor structure, method for depositing a dipole layer on a substrate, and associated methods for forming a gate structure for a semiconductor deviceASM IP HOLDING BV·Filed 2025·Application pending·0 cites
- 4855US10566271B2Carrier-free semiconductor package and fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·13 claims
- 4954US8716861B2Semiconductor package having electrical connecting structures and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·0 cites·7 claims
- 5054US2025349548A1Method, system and apparatus for forming metal-insulator-metal and/or metal-ferroelectric-metal deviceASM IP HOLDING BV·Filed 2025·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →