Inventor · disambiguated record
Galen W. Miller
Also filed as: MILLER GALEN · MILLER GALEN W
13 granted patents·45 citations·filing 2015–2021
88Inventor score
Files withKEMET ELECTRONICS CORP13
Top patents by PatentIndex Score
13 records- 0196US10707145B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jul 7, 2020·24 cites·44 claims
- 0291US10178770B1Higher density multi-component and serial packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·6 cites·43 claims
- 0391US9805872B2Multiple MLCC modulesKEMET ELECTRONICS CORP·Filed 2015·Granted Oct 31, 2017·5 cites·38 claims
- 0486US10381162B2Leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2017·Granted Aug 13, 2019·5 cites·32 claims
- 0582US10681814B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jun 9, 2020·3 cites·60 claims
- 0671US10984955B2Electronic component structures with reduced microphonic noiseKEMET ELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·1 cites·37 claims
- 0767US10366836B2Electronic component structures with reduced microphonic noiseKEMET ELECTRONICS CORP·Filed 2016·Granted Jul 30, 2019·1 cites·30 claims
- 0863US10757811B2Higher density multi-component and serial packagesKEMET ELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·30 claims
- 0957US10790094B2Method of forming a leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
- 1055US11923151B2Structural lead frameKEMET ELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·45 claims
- 1153US10757810B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·60 claims
- 1251US11744018B2Component assemblies and embedding for high density electronicsKEMET ELECTRONICS CORP·Filed 2021·Granted Aug 29, 2023·0 cites·55 claims
- 1340US10224149B2Bulk MLCC capacitor moduleKEMET ELECTRONICS CORP·Filed 2016·Granted Mar 5, 2019·0 cites·55 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →