Inventor · disambiguated record
Bohan Yoon
Also filed as: YOON BOHAN
4 granted patents·21 citations·filing 2007–2011
71Inventor score
Top patents by PatentIndex Score
4 records- 0179US8035211B2Integrated circuit package system with support structure under wire-in-film adhesiveSTATS CHIPPAC LTD·Filed 2008·Granted Oct 11, 2011·12 cites·20 claims
- 0278US7892072B2Method for directional grinding on backside of a semiconductor waferSTATS CHIPPAC LTD·Filed 2007·Granted Feb 22, 2011·7 cites·19 claims
- 0365US7659140B2Integrated circuit system with a debris trapping systemSTATS CHIPPAC LTD·Filed 2007·Granted Feb 9, 2010·2 cites·20 claims
- 0444US8994196B2System and method for directional grinding on backside of a semiconductor waferLEE SUNGYOON·Filed 2011·Granted Mar 31, 2015·0 cites·25 claims
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