Inventor · disambiguated record
Seung Jae Chung
Also filed as: CHUNG SEUNG JAE
9 granted patents·1 pending application·96 citations·filing 2001–2013
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4LEE SANG-KYU2HYNIX SEMICONDUCTOR INC1MITSUBISHI MATERIALS CORP1SK HYNIX INC1
Top patents by PatentIndex Score
10 records- 0182US6950929B2Loop instruction processing using loop buffer in a data processing device having a coprocessorSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 27, 2005·37 cites·23 claims
- 0278US8154919B2Method of reading nonvolatile memory device and nonvolatile memory device for implementing the methodLEE SANG KYU·Filed 2009·Granted Apr 10, 2012·11 cites·12 claims
- 0374US9298650B2Memory system, semiconductor memory device and operating method thereofSK HYNIX INC·Filed 2013·Granted Mar 29, 2016·4 cites·20 claims
- 0474US7249300B2Integrated circuit device including a scan test circuit and methods of testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 24, 2007·18 cites·24 claims
- 0569US8014207B2Nonvolatile memory device and method of operating the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Sep 6, 2011·7 cites·15 claims
- 0666US7543218B2DVD decoding method and apparatus using selective po-correctionSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 2, 2009·6 cites·36 claims
- 0764US6950922B2Data extraction/insertion method and device in digital signal processorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 27, 2005·11 cites·18 claims
- 0850US6872115B2Blade with comb teeth coated with a compound layer for forming ribs and its production methodMITSUBISHI MATERIALS CORP·Filed 2002·Granted Mar 29, 2005·2 cites·24 claims
- 0939US2002155937A1Paste for forming ceramic ribs, production method for the same and forming method of ribs used the sameFiled 2002·Application pending·0 cites
- 1035US8504896B2Method of operating nonvolatile memory device and nonvolatile memory device for implementing the sameLEE SANG KYU·Filed 2010·Granted Aug 6, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →