Inventor · disambiguated record
Tatsunari Mii
Also filed as: MII TATSUNARI
29 granted patents·7 pending applications·402 citations·filing 1992–2012
97Inventor score
Top patents by PatentIndex Score
36 records- 0197US7621436B2Wire bonding methodSHINKAWA KK·Filed 2006·Granted Nov 24, 2009·128 cites·11 claims
- 0292US7821140B2Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2010·Granted Oct 26, 2010·16 cites·6 claims
- 0379US7934634B2Wire bonding methodSHINKAWA KK·Filed 2009·Granted May 3, 2011·8 cites·4 claims
- 0477US8815732B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2012·Granted Aug 26, 2014·4 cites·5 claims
- 0573US7044357B2Bump formation method and wire bonding methodSHINKAWA KK·Filed 2004·Granted May 16, 2006·21 cites·4 claims
- 0673US6041995AWire bonding methodSHINKAWA KK·Filed 1998·Granted Mar 28, 2000·42 cites·6 claims
- 0770US8143155B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2009·Granted Mar 27, 2012·4 cites·11 claims
- 0869US7808116B2Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2008·Granted Oct 5, 2010·5 cites·15 claims
- 0965US7025247B2Wire bonding methodSHINKAWA KK·Filed 2004·Granted Apr 11, 2006·11 cites·1 claims
- 1060US5884830ACapillary for a wire bonding apparatusSHINKAWA KK·Filed 1997·Granted Mar 23, 1999·24 cites·7 claims
- 1159US5906308ACapillary for use in a wire bonding apparatusSHINKAWA KK·Filed 1997·Granted May 25, 1999·23 cites·3 claims
- 1258US6595400B2Wire bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 22, 2003·8 cites·3 claims
- 1358US6467678B2Wire bonding method and apparatusSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·9 cites·10 claims
- 1458US6080651AWire bonding methodSHINKAWA KK·Filed 1998·Granted Jun 27, 2000·22 cites·5 claims
- 1556US6036080AWire bonding methodSHINKAWA KK·Filed 1998·Granted Mar 14, 2000·20 cites·4 claims
- 1656US2007029367A1Semiconductor deviceSHINKAWA KK·Filed 2006·Application pending·0 cites
- 1755US8678266B2Wire bonding methodMII TATSUNARI·Filed 2006·Granted Mar 25, 2014·1 cites·17 claims
- 1855US7661576B2Wire bonding methodSHINKAWA KK·Filed 2008·Granted Feb 16, 2010·0 cites·1 claims
- 1953US7851347B2Wire bonding method and semiconductor deviceSHINKAWA KK·Filed 2009·Granted Dec 14, 2010·0 cites·8 claims
- 2053US6645346B2Workpiece holding device for a bonding apparatusSHINKAWA KK·Filed 2002·Granted Nov 11, 2003·6 cites·4 claims
- 2152US7617966B2Semiconductor deviceSHINKAWA KK·Filed 2006·Granted Nov 17, 2009·0 cites·3 claims
- 2247US7910472B2Method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2010·Granted Mar 22, 2011·0 cites·7 claims
- 2346US2009001608A1Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2446US2006175383A1Wire bonding methodSHINKAWA KK·Filed 2006·Application pending·0 cites
- 2546US2009020872A1Wire bonding method and semiconductor deviceSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2645US8232656B2Semiconductor deviceMII TATSUNARI·Filed 2010·Granted Jul 31, 2012·0 cites·4 claims
- 2745US6325269B1Wire bonding capillaryTOTO LTD·Filed 1998·Granted Dec 4, 2001·16 cites·13 claims
- 2843US7458498B2Semiconductor device and a wire bonding methodSHINKAWA KK·Filed 2004·Granted Dec 2, 2008·0 cites·1 claims
- 2943US2005092815A1Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2004·Application pending·0 cites
- 3042US5958259AMethod for forming a ball in wire bondingSHINKAWA KK·Filed 1997·Granted Sep 28, 1999·11 cites·1 claims
- 3142US2007187467A1Method for forming a stud bumpSHINKAWA KK·Filed 2007·Application pending·0 cites
- 3241US5259548AWire bonding methodSHINKAWA KK·Filed 1992·Granted Nov 9, 1993·11 cites·2 claims
- 3339US6173885B1Method for forming a ball in wire bondingSHINKAWA KK·Filed 1999·Granted Jan 16, 2001·7 cites·2 claims
- 3436US2010155455A1Wire bonding methodSHINKAWA KK·Filed 2010·Application pending·0 cites
- 3534US5524811AWire bonding methodSHINKAWA KK·Filed 1994·Granted Jun 11, 1996·5 cites·7 claims
- 3630US5261777APushing deviceSHINKAWA KK·Filed 1992·Granted Nov 16, 1993·0 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →