Assignee
MII TATSUNARI
JP·4 granted patents·9 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0177US8815732B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2012·Granted Aug 26, 2014·4 cites·5 claims
- 0270US8143155B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2009·Granted Mar 27, 2012·4 cites·11 claims
- 0355US8678266B2Wire bonding methodMII TATSUNARI·Filed 2006·Granted Mar 25, 2014·1 cites·17 claims
- 0445US8232656B2Semiconductor deviceMII TATSUNARI·Filed 2010·Granted Jul 31, 2012·0 cites·4 claims
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