Inventor · disambiguated record
Michael Goodner
Also filed as: GOODNER MICHAEL · GOODNER MICHAEL D
50 granted patents·18 pending applications·1,726 citations·filing 1996–2011
98Inventor score
Top patents by PatentIndex Score
68 records- 0199US6876017B2Polymer sacrificial light absorbing structure and methodINTEL CORP·Filed 2003·Granted Apr 5, 2005·542 cites·24 claims
- 0298US6946384B2Stacked device underfill and a method of fabricationINTEL CORP·Filed 2003·Granted Sep 20, 2005·235 cites·23 claims
- 0398US6566280B1Forming polymer features on a substrateINTEL CORP·Filed 2002·Granted May 20, 2003·297 cites·22 claims
- 0494US7018918B2Method of forming a selectively converted inter-layer dielectric using a porogen materialINTEL CORP·Filed 2003·Granted Mar 28, 2006·76 cites·13 claims
- 0593US7125582B2Low-temperature silicon nitride depositionINTEL CORP·Filed 2003·Granted Oct 24, 2006·57 cites·6 claims
- 0692US6737365B1Forming a porous dielectric layerINTEL CORP·Filed 2003·Granted May 18, 2004·61 cites·15 claims
- 0791US7241707B2Layered films formed by controlled phase segregationINTEL CORP·Filed 2005·Granted Jul 10, 2007·22 cites·44 claims
- 0890US8992806B2Antireflective coatings for via fill and photolithography applications and methods of preparation thereofLI BO·Filed 2011·Granted Mar 31, 2015·6 cites·27 claims
- 0990US7071091B2Method of forming air gaps in a dielectric material using a sacrificial filmINTEL CORP·Filed 2004·Granted Jul 4, 2006·50 cites·19 claims
- 1090US6893985B2UV-activated dielectric layerINTEL CORP·Filed 2003·Granted May 17, 2005·40 cites·16 claims
- 1189US7466025B2Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxideINTEL CORP·Filed 2005·Granted Dec 16, 2008·12 cites·25 claims
- 1287US7595555B2Method of forming air gaps in a dielectric material using a sacrificial film and resulting structuresINTEL CORP·Filed 2006·Granted Sep 29, 2009·13 cites·6 claims
- 1387US6924222B2Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxideINTEL CORP·Filed 2002·Granted Aug 2, 2005·32 cites·21 claims
- 1484US6991893B2Controlling resist profiles through substrate modificationINTEL CORP·Filed 2002·Granted Jan 31, 2006·20 cites·22 claims
- 1581US7365375B2Organic-framework zeolite interlayer dielectricsINTEL CORP·Filed 2005·Granted Apr 29, 2008·10 cites·11 claims
- 1680US7303989B2Using zeolites to improve the mechanical strength of low-k interlayer dielectricsINTEL CORP·Filed 2004·Granted Dec 4, 2007·22 cites·9 claims
- 1779US7157755B2Polymer sacrificial light absorbing structure and methodINTEL CORP·Filed 2005·Granted Jan 2, 2007·7 cites·21 claims
- 1878US5730601AMethod and material for use with dental composites for improving conversion of monomers to polymers and reducing volume shrinkageUNIV COLORADO·Filed 1996·Granted Mar 24, 1998·50 cites·20 claims
- 1976US7732936B2Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymerINTEL CORP·Filed 2006·Granted Jun 8, 2010·6 cites·21 claims
- 2076US7294568B2Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structuresINTEL CORP·Filed 2004·Granted Nov 13, 2007·22 cites·25 claims
- 2176US7169715B2Forming a dielectric layer using porogensINTEL CORP·Filed 2003·Granted Jan 30, 2007·18 cites·20 claims
- 2274US6858528B2Composite sacrificial materialINTEL CORP·Filed 2003·Granted Feb 22, 2005·17 cites·20 claims
- 2372US6682989B1Plating a conductive material on a dielectric materialINTEL CORP·Filed 2002·Granted Jan 27, 2004·12 cites·14 claims
- 2470US7585615B2Composite photoresist for modifying die-side bumpsINTEL CORP·Filed 2006·Granted Sep 8, 2009·4 cites·10 claims
- 2570US7344972B2Photosensitive dielectric layerINTEL CORP·Filed 2004·Granted Mar 18, 2008·16 cites·15 claims
- 2668US7572732B2Method to modulate etch rate in SLAMINTEL CORP·Filed 2006·Granted Aug 11, 2009·2 cites·4 claims
- 2768US7018920B2Composite sacrificial materialINTEL CORP·Filed 2004·Granted Mar 28, 2006·12 cites·10 claims
- 2867US7439179B2Healing detrimental bonds in deposited materialsINTEL CORP·Filed 2005·Granted Oct 21, 2008·2 cites·14 claims
- 2966US8053159B2Antireflective coatings for via fill and photolithography applications and methods of preparation thereofHONEYWELL INT INC·Filed 2003·Granted Nov 8, 2011·6 cites·16 claims
- 3065US7101798B2Method to modulate etch rate in SLAMINTEL CORP·Filed 2003·Granted Sep 5, 2006·8 cites·5 claims
- 3164US6908717B2Positive photosensitive resin composition, process for its preparation, and semiconductor devicesINTEL CORP·Filed 2001·Granted Jun 21, 2005·9 cites·12 claims
- 3262US7563727B2Low-k dielectric layer formed from aluminosilicate precursorsINTEL CORP·Filed 2004·Granted Jul 21, 2009·4 cites·13 claims
- 3362US7030040B2Selectively growing a polymeric material on a semiconductor substrateINTEL CORP·Filed 2002·Granted Apr 18, 2006·6 cites·16 claims
- 3462US6867473B2Plating a conductive material on a dielectric materialINTEL CORP·Filed 2003·Granted Mar 15, 2005·6 cites·11 claims
- 3561US7071125B2Precursors for film formationINTEL CORP·Filed 2004·Granted Jul 4, 2006·8 cites·23 claims
- 3660US7560165B2Sealing porous dielectric materialsINTEL CORP·Filed 2005·Granted Jul 14, 2009·2 cites·4 claims
- 3752US7470450B2Forming a silicon nitride filmINTEL CORP·Filed 2004·Granted Dec 30, 2008·3 cites·3 claims
- 3852US7029723B2Forming chemical vapor depositable low dielectric constant layersINTEL CORP·Filed 2003·Granted Apr 18, 2006·3 cites·5 claims
- 3951US7358597B2UV-activated dielectric layerINTEL CORP·Filed 2005·Granted Apr 15, 2008·0 cites·5 claims
- 4050US7034399B2Forming a porous dielectric layerINTEL CORP·Filed 2004·Granted Apr 25, 2006·2 cites·4 claims
- 4149US8513111B2Forming semiconductor structuresMEAGLEY ROBERT P·Filed 2006·Granted Aug 20, 2013·0 cites·3 claims
- 4249US7138158B2Forming a dielectric layer using a hydrocarbon-containing precursorINTEL CORP·Filed 2003·Granted Nov 21, 2006·2 cites·26 claims
- 4348US7180180B2Stacked device underfill and a method of fabricationINTEL CORP·Filed 2004·Granted Feb 20, 2007·2 cites·20 claims
- 4447US7658975B2Sealing porous dielectric materialsINTEL CORP·Filed 2003·Granted Feb 9, 2010·2 cites·13 claims
- 4546US2007032675A1Forming a dielectric layer using a hydrocarbon-containing precursorMEAGLEY ROBERT P·Filed 2006·Application pending·0 cites
- 4645US7452728B2Metal ion separation from aqueous solutions using photoswitchable ionophoresINTEL CORP·Filed 2004·Granted Nov 18, 2008·0 cites·30 claims
- 4744US7790630B2Silicon-doped carbon dielectricsINTEL CORP·Filed 2005·Granted Sep 7, 2010·0 cites·9 claims
- 4843US2006118922A1Selectively growing a polymeric material on a semiconductor substrateGOODNER MICHAEL D·Filed 2006·Application pending·0 cites
- 4943US2009133908A1Interconnect structure for a microelectronic device, method of manfacturing same, and microelectronic structure containing sameGOODNER MICHAEL D·Filed 2007·Application pending·0 cites
- 5042US8104172B2Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymerGOODNER MICHAEL D·Filed 2010·Granted Jan 31, 2012·0 cites·14 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →