Inventor · disambiguated record
Matthew Tingey
Also filed as: TINGEY MATTHEW · TINGEY MATTHEW L · TINGEY MATTHEW LEE
13 granted patents·7 pending applications·62 citations·filing 2002–2025
88Inventor score
Files withINTEL CORP15WALLACE CHARLES H2ABBOTT NICHOLAS L1WALLACE CHARLES1WISCONSIN ALUMNI RES FOUND1
Top patents by PatentIndex Score
20 records- 0193US11676891B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0286US11088062B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2017·Granted Aug 10, 2021·4 cites·14 claims
- 0384US7915171B2Double patterning techniques and structuresINTEL CORP·Filed 2008·Granted Mar 29, 2011·10 cites·20 claims
- 0483US12224103B2Angled inductor with small form factorINTEL CORP·Filed 2021·Granted Feb 11, 2025·1 cites·9 claims
- 0582US6849321B2Surfaces with gradients in surface topographyWISCONSIN ALUMNI RES FOUND·Filed 2002·Granted Feb 1, 2005·38 cites·33 claims
- 0676US12230563B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2022·Granted Feb 18, 2025·0 cites·21 claims
- 0775US2025149433A1New method to enable 30 microns pitch emib or belowINTEL CORP·Filed 2025·Application pending·0 cites
- 0863US8133680B2Using liquid crystals to detect affinity microcontact printed biomoleculesABBOTT NICHOLAS L·Filed 2004·Granted Mar 13, 2012·6 cites·16 claims
- 0957US8409690B2Patterned nanowiresWALLACE CHARLES H·Filed 2010·Granted Apr 2, 2013·1 cites·11 claims
- 1057US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 1156US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 1254US11817349B2Conductive route patterning for electronic substratesINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 1352US8233210B2Illumination aperture for optical lithographyWALLACE CHARLES·Filed 2008·Granted Jul 31, 2012·0 cites·6 claims
- 1452US2024222249A1Integrated circuit device package substrates with glass core layer having roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 1551US2024203853A1Dry film photoresist wet lamination and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 1651US2024282591A1Tools and methods for surface levelingINTEL CORP·Filed 2023·Application pending·0 cites
- 1750US2021318612A1Composite dry film resist for photolithographyINTEL CORP·Filed 2021·Application pending·0 cites
- 1850US2024222137A1Enabling copper recess flattening through a dfr patterning processesINTEL CORP·Filed 2022·Application pending·0 cites
- 1946US12255130B2Airgap structures for high speed signal integrityINTEL CORP·Filed 2020·Granted Mar 18, 2025·0 cites·17 claims
- 2043US9142421B2Double patterning lithography techniquesWALLACE CHARLES H·Filed 2011·Granted Sep 22, 2015·0 cites·25 claims
Join the waitlist — get patent alerts
Get an alert when Matthew Tingey files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →