Inventor · disambiguated record
Tz-Cheng Chiu
Also filed as: CHIU TZ-CHENG
15 granted patents·8 pending applications·177 citations·filing 2002–2011
93Inventor score
Top patents by PatentIndex Score
23 records- 0187US8431437B2Packaging method involving rearrangement of diceCHEN YU-REN·Filed 2011·Granted Apr 30, 2013·8 cites·16 claims
- 0287US7572677B2Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression supportTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 11, 2009·14 cites·11 claims
- 0385US6784535B1Composite lid for land grid array (LGA) flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 31, 2004·35 cites·10 claims
- 0483US7126217B2Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression supportTEXAS INSTRUMENTS INC·Filed 2004·Granted Oct 24, 2006·30 cites·15 claims
- 0578US6696644B1Polymer-embedded solder bumps for reliable plastic package attachmentTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 24, 2004·25 cites·11 claims
- 0675US7294451B2Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit boardTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 13, 2007·20 cites·10 claims
- 0774US6734567B2Flip-chip device strengthened by substrate metal ringTEXAS INSTRUMENTS INC·Filed 2002·Granted May 11, 2004·21 cites·5 claims
- 0870US7393719B2Increased stand-off height integrated circuit assemblies, systems, and methodsTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 1, 2008·4 cites·6 claims
- 0965US7267861B2Solder joints for copper metallization having reduced interfacial voidsTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 11, 2007·3 cites·17 claims
- 1062US6977429B2Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 20, 2005·9 cites·7 claims
- 1157US7323362B2Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 29, 2008·1 cites·4 claims
- 1257US6861292B2Composite lid for land grid array (LGA) flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 1, 2005·6 cites·14 claims
- 1353US2009047754A1Packaging method involving rearrangement of diceCHIPMOS TECHNOLOGIES BERMUDA·Filed 2008·Application pending·0 cites
- 1450US2008218986A1Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and MethodsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1549US8426245B2Packaging method involving rearrangement of diceCHEN YU-REN·Filed 2011·Granted Apr 23, 2013·0 cites·14 claims
- 1649US7679190B2Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit boardTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 16, 2010·0 cites·8 claims
- 1744US6903000B2System for improving thermal stability of copper damascene structureTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 7, 2005·1 cites·8 claims
- 1844US2005186788A1System for improving thermal stability of copper damascene structureFiled 2005·Application pending·0 cites
- 1939US2006270106A1System and method for polymer encapsulated solder lid attachCHIU TZ-CHENG·Filed 2005·Application pending·0 cites
- 2037US2005133928A1Wire loop grid array packageFiled 2003·Application pending·0 cites
- 2137US2004149479A1Polymer-embedded solder bumps for reliable plastic package attachmentFiled 2004·Application pending·0 cites
- 2235US2006043586A1Board level solder joint support for BGA packages under heatsink compressionTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2334US2005275096A1Pre-doped reflow interconnections for copper padsZENG KEJUN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →