Inventor · disambiguated record
Toshihiro Nishii
Also filed as: NISHII TOSHIHIRO
32 granted patents·6 pending applications·232 citations·filing 1998–2019
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD26PANASONIC CORP4SAKAI CHEMICAL INDUSTRY CO2KIMURA JUNICHI1MATUSHITA ELECTRIC IND CO LTD1
Top patents by PatentIndex Score
38 records- 0185US6893530B2Method and system of drying materials and method of manufacturing circuit boards using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted May 17, 2005·35 cites·23 claims
- 0285US6518515B2Printed wiring board, and method and apparatus for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 11, 2003·30 cites·5 claims
- 0384US6558780B2Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·24 cites·11 claims
- 0476US6698093B2Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 2, 2004·16 cites·20 claims
- 0575US6996902B2Method for manufacturing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·14 cites·8 claims
- 0670US7572500B2Method of manufacturing circuit-forming board and material of circuit-forming boardPANASONIC CORP·Filed 2007·Granted Aug 11, 2009·3 cites·5 claims
- 0767US6528733B2Multi-layer circuit board and method of manufacturing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 4, 2003·12 cites·29 claims
- 0866US7317621B2Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jan 8, 2008·12 cites·25 claims
- 0965US7685707B2Method for manufacturing circuit forming substratePANASONIC CORP·Filed 2006·Granted Mar 30, 2010·2 cites·16 claims
- 1065US7624502B2Method for producing circuit-forming board and material for producing circuit-forming boardPANASONIC CORP·Filed 2005·Granted Dec 1, 2009·3 cites·20 claims
- 1161US6838164B2Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 4, 2005·6 cites·3 claims
- 1261US6820331B2Method of manufacturing a circuit board and its manufacturing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 23, 2004·8 cites·33 claims
- 1358US10947377B2Chlorine-containing resin compositionSAKAI CHEMICAL INDUSTRY CO·Filed 2017·Granted Mar 16, 2021·0 cites·5 claims
- 1458US6365844B2Printed wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 2, 2002·20 cites·7 claims
- 1556US6890449B2Method for manufacturing printed-circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 10, 2005·6 cites·12 claims
- 1654US6700071B2Multi-layer circuit board having at least two or more circuit patterns connectedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 2, 2004·4 cites·15 claims
- 1753US7105277B2Printing plate, circuit board and method of printing circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 12, 2006·4 cites·25 claims
- 1853US2021371621A1Liquid stabilizer for chlorine-containing resin, and method for manufacturing sameSAKAI CHEMICAL INDUSTRY CO·Filed 2019·Application pending·0 cites
- 1951US6993836B2Circuit board and method of manufacturing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 7, 2006·3 cites·22 claims
- 2051US6814836B2Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 9, 2004·2 cites·6 claims
- 2151US6686029B2Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 3, 2004·2 cites·10 claims
- 2251US2006210780A1Circuit board and production method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2350US7325300B2Method of manufacturing printed wiring boardsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 5, 2008·4 cites·24 claims
- 2450US6671951B2Printed wiring board, and method and apparatus for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 6, 2004·3 cites·61 claims
- 2549US7754321B2Method of manufacturing clad board for forming circuitry, clad board and core board for clad boardPANASONIC CORP·Filed 2003·Granted Jul 13, 2010·2 cites·18 claims
- 2649US7251885B2Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 7, 2007·2 cites·1 claims
- 2748US6833042B2Method of manufacturing clad board for forming circuitry, clad board, and core board for clad boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 21, 2004·2 cites·12 claims
- 2847US7356916B2Circuit-formed substrate and method of manufacturing circuit-formed substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 15, 2008·3 cites·4 claims
- 2947US7097394B2Circuit board production method and circuit board production dataMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 29, 2006·2 cites·20 claims
- 3047US7059044B2Method and material for manufacturing circuit-formed substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 13, 2006·2 cites·7 claims
- 3145US8069557B2Method of manufacturing circuit forming boardNISHII TOSHIHIRO·Filed 2004·Granted Dec 6, 2011·0 cites·12 claims
- 3242US2008073024A1Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatusKIMURA JUNICHI·Filed 2007·Application pending·0 cites
- 3341US7143772B2Method of manufacturing a circuit board and its manufacturing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 5, 2006·0 cites·5 claims
- 3441US2003113522A1Circuit board and production method thereforFiled 2002·Application pending·0 cites
- 3540US6409869B1Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 25, 2002·6 cites·20 claims
- 3638US2005233122A1Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use thereinNISHIMURA MIKIO·Filed 2005·Application pending·0 cites
- 3736US2003047269A1Method for manufacturing circuit boardFiled 2001·Application pending·0 cites
- 3835US7018672B2Circuit board producing method and circuit board producing deviceMATUSHITA ELECTRIC IND CO LTD·Filed 2001·Granted Mar 28, 2006·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →