Inventor · disambiguated record
Nobukazu Ito
Also filed as: ITO NOBUKAZU
16 granted patents·2 pending applications·284 citations·filing 1991–2005
94Inventor score
Top patents by PatentIndex Score
18 records- 0189US6252234B1Reaction force isolation system for a planar motorNIKON CORP·Filed 1998·Granted Jun 26, 2001·55 cites·28 claims
- 0286US6538719B1Exposure apparatus and exposure method, and device and method for producing the sameNIKON CORP·Filed 1999·Granted Mar 25, 2003·62 cites·15 claims
- 0378US6573607B2Semiconductor device and manufacturing method thereofNEC ELECTRONICS CORP·Filed 2001·Granted Jun 3, 2003·17 cites·12 claims
- 0478US6317221B1Image reading device and methodNIKON CORP·Filed 2000·Granted Nov 13, 2001·13 cites·22 claims
- 0574US6268090B1Process for manufacturing semiconductor device and exposure maskNEC CORP·Filed 2000·Granted Jul 31, 2001·14 cites·7 claims
- 0673US7239002B2Integrated circuit deviceNEC CORP·Filed 2005·Granted Jul 3, 2007·6 cites·20 claims
- 0773US6309970B1Method of forming multi-level copper interconnect with formation of copper oxide on exposed copper surfaceNEC CORP·Filed 1999·Granted Oct 30, 2001·36 cites·18 claims
- 0871US7391092B2Integrated circuit including a temperature monitor element and thermal conducting layerNEC ELECTRONICS CORP·Filed 2005·Granted Jun 24, 2008·5 cites·18 claims
- 0966US7462921B2Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide filmNEC CORP·Filed 2005·Granted Dec 9, 2008·2 cites·20 claims
- 1065US5543357AProcess of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metalNEC CORP·Filed 1994·Granted Aug 6, 1996·27 cites·5 claims
- 1161US7741692B2Integrated circuit device with temperature monitor membersNEC ELECTRONICS CORP·Filed 2005·Granted Jun 22, 2010·2 cites·10 claims
- 1260US5155063AMethod of fabricating semiconductor device including an al/tin/ti contactNEC CORP·Filed 1991·Granted Oct 13, 1992·29 cites·5 claims
- 1347US6512281B2Method of forming a semiconductor device and an improved deposition systemNEC CORP·Filed 2001·Granted Jan 28, 2003·1 cites·6 claims
- 1442US6465354B1Method of improving the planarization of wiring by CMPNEC CORP·Filed 1999·Granted Oct 15, 2002·10 cites·19 claims
- 1541US7777288B2Integrated circuit device and fabrication method thereforNEC ELECTRONICS CORP·Filed 2005·Granted Aug 17, 2010·0 cites·21 claims
- 1640US2001026906A1Process for manufacturing semiconductor device and exposure maskNEC CORP·Filed 2001·Application pending·0 cites
- 1738US2003186540A1Method and apparatus for forming fine circuit interconnectsFiled 2003·Application pending·0 cites
- 1837US6372114B1Method of forming a semiconductor deviceNEC CORP·Filed 1999·Granted Apr 16, 2002·5 cites·6 claims
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