Inventor · disambiguated record
Jeong-Kyu Ha
Also filed as: HA JEONG-KYU
29 granted patents·11 pending applications·121 citations·filing 2009–2024
95Inventor score
Top patents by PatentIndex Score
40 records- 0194US8853694B2Chip on film package including test pads and semiconductor devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 7, 2014·20 cites·11 claims
- 0292US9177904B2Chip-on-film package and device assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·16 cites·12 claims
- 0391US9113545B2Tape wiring substrate and chip-on-film package including the sameHAN SANG-UK·Filed 2012·Granted Aug 18, 2015·15 cites·16 claims
- 0489US9349683B2Chip-on-film package having bending partSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 24, 2016·7 cites·20 claims
- 0589US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0685US9818732B2Chip-on-film package and device assembly including the sameJUNG JAE-MIN·Filed 2015·Granted Nov 14, 2017·6 cites·13 claims
- 0784US9922891B2Film for semiconductor package, semiconductor package using film and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 20, 2018·4 cites·20 claims
- 0883US10304764B2Film product, film packages and package modules using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·5 cites·19 claims
- 0982US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 1080US9280182B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·5 cites·20 claims
- 1180US9241407B2Tape film packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 19, 2016·4 cites·11 claims
- 1278US10134667B2Chip-on-film semiconductor packages and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 20, 2018·2 cites·20 claims
- 1378US9059162B2Chip on film (COF) substrate, COF package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·5 cites·20 claims
- 1477US9978674B2Chip-on-film semiconductor packages and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·2 cites·9 claims
- 1575US9437526B2Chip on film package including distributed via plugsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 6, 2016·4 cites·18 claims
- 1674US10504829B2Semiconductor package and semiconductor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 1772US12191246B2Chip-on-film package having redistribution pattern between semiconductor chip and connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 1867US9620389B2Methods of fabricating tape film packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·10 claims
- 1967US9305990B2Chip-on-film package and device assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 5, 2016·2 cites·18 claims
- 2066US11830803B2Chip-on-film package having redistribution pattern between semiconductor chip and connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·19 claims
- 2165US9576865B2Film for semiconductor package, semiconductor package using film and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 21, 2017·1 cites·20 claims
- 2262US10282587B2Sensing module substrate and sensing module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 7, 2019·1 cites·20 claims
- 2362US9362333B2Semiconductor packages and display devices including semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·1 cites·23 claims
- 2459US2024079311A1Film substrate, semiconductor package including the film substrate, and method using the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2556US2020372232A1Fingerprint sensor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 2655US2025062211A1Driving circuit mounting filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2754US11600556B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2854US2025329619A1Semiconductor package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2953US10776601B2Fingerprint sensor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 3053US2023176108A1Semiconductor package and method of testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3152US2024413071A1Semiconductor package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3251US11764140B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3349US9313889B2Display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 12, 2016·0 cites·17 claims
- 3449US2024234277A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3548US2016162091A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3644US8940621B2Methods of forming semiconductor modules including flexible panelsHAN SANG-UK·Filed 2012·Granted Jan 27, 2015·0 cites·10 claims
- 3741US2013240917A1Semiconductor package having a conductive layer for electrostatic discharge and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3837US2014367659A1Display devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3937US2012021600A1Method of fabricating film circuit substrate and method of fabricating chip package including the sameHAN SANG-UK·Filed 2011·Application pending·0 cites
- 4029US9929083B2Semiconductor packages and package modules using the sameHA JEONG KYU·Filed 2016·Granted Mar 27, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →