Inventor · disambiguated record
Shimpei Obata
Also filed as: OBATA SHIMPEI
4 granted patents·2 pending applications·0 citations·filing 2016–2019
53Inventor score
Files withPANASONIC IP MAN CO LTD6
Top patents by PatentIndex Score
6 records- 0151US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 0245US11414528B2Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resinPANASONIC IP MAN CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·11 claims
- 0340US10472478B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Nov 12, 2019·0 cites·5 claims
- 0440US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 0534US2022025171A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 0630US11647583B2Prepreg, metal-clad laminated board, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted May 9, 2023·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →