Inventor · disambiguated record
Keiichi Kajiyama
Also filed as: KAJIYAMA KEIICHI
15 granted patents·3 pending applications·152 citations·filing 1983–2011
93Inventor score
Top patents by PatentIndex Score
18 records- 0188US8268656B2Optical device wafer processing methodKAJIYAMA KEIICHI·Filed 2010·Granted Sep 18, 2012·13 cites·2 claims
- 0288US8025556B2Method of grinding waferDISCO CORP·Filed 2009·Granted Sep 27, 2011·14 cites·4 claims
- 0385US7677955B2Grinding method for waferDISCO CORP·Filed 2008·Granted Mar 16, 2010·12 cites·5 claims
- 0482US7629230B2Wafer processing methodDISCO CORP·Filed 2008·Granted Dec 8, 2009·8 cites·2 claims
- 0581US4547998AElectrodeposited grinding toolDISCO ABRASIVE SYSTEMS LTD·Filed 1983·Granted Oct 22, 1985·32 cites·24 claims
- 0680US7527547B2Wafer processing methodDISCO CORP·Filed 2007·Granted May 5, 2009·8 cites·2 claims
- 0778US8415232B2Dividing method for wafer having die bonding film attached to the back side thereofKAJIYAMA KEIICHI·Filed 2011·Granted Apr 9, 2013·5 cites·3 claims
- 0878US7858530B2Processing method for wafer and processing apparatus thereforDISCO CORP·Filed 2007·Granted Dec 28, 2010·6 cites·4 claims
- 0976US6939785B2Process for manufacturing a semiconductor chipDISCO CORP·Filed 2004·Granted Sep 6, 2005·25 cites·5 claims
- 1069US7718511B2Processing method for waferDISCO CORP·Filed 2007·Granted May 18, 2010·3 cites·6 claims
- 1161US7816264B2Wafer processing methodDISCO CORP·Filed 2008·Granted Oct 19, 2010·2 cites·2 claims
- 1261US7625810B2Wafer processing methodDISCO CORP·Filed 2006·Granted Dec 1, 2009·1 cites·3 claims
- 1360US7858496B2Wafer processing methodDISCO CORP·Filed 2009·Granted Dec 28, 2010·2 cites·4 claims
- 1446US6171176B1Method of effecting a precision saw-toothed grinding on the surface of a given workpieceDISCO CORP·Filed 1999·Granted Jan 9, 2001·12 cites·3 claims
- 1546US2006094210A1Semiconductor wafer processing method and processing apparatusKAJIYAMA KEIICHI·Filed 2005·Application pending·0 cites
- 1642US2005054274A1Semiconductor wafer processing method and processing apparatusFiled 2004·Application pending·0 cites
- 1741US6306274B1Method for making electrodeposition bladesDISCO CORP·Filed 1999·Granted Oct 23, 2001·9 cites·5 claims
- 1833US2011097875A1Wafer processing methodDISCO CORP·Filed 2010·Application pending·0 cites
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