Assignee
DISCO ABRASIVE SYSTEMS LTD
JP·18 granted patents·633 citations·filing 1983–1988
Top patents by PatentIndex Score
18 records- 0197US4693036ASemiconductor wafer surface grinding apparatusDISCO ABRASIVE SYSTEMS LTD·Filed 1984·Granted Sep 15, 1987·69 cites·3 claims
- 0297US4688540ASemiconductor wafer dicing machineDISCO ABRASIVE SYSTEMS LTD·Filed 1985·Granted Aug 25, 1987·119 cites·15 claims
- 0391US4757550AAutomatic accurate alignment systemDISCO ABRASIVE SYSTEMS LTD·Filed 1985·Granted Jul 12, 1988·53 cites·10 claims
- 0489US4565034AGrinding and/or cutting endless beltDISCO ABRASIVE SYSTEMS LTD·Filed 1984·Granted Jan 21, 1986·51 cites·3 claims
- 0586US4753049AMethod and apparatus for grinding the surface of a semiconductorDISCO ABRASIVE SYSTEMS LTD·Filed 1986·Granted Jun 28, 1988·38 cites·5 claims
- 0683US4705016APrecision device for reducing errors attributed to temperature change reducedDISCO ABRASIVE SYSTEMS LTD·Filed 1986·Granted Nov 10, 1987·52 cites·4 claims
- 0782US4558686AMachining device equipped with blade inspecting meansDISCO ABRASIVE SYSTEMS LTD·Filed 1984·Granted Dec 17, 1985·28 cites·10 claims
- 0881US4547998AElectrodeposited grinding toolDISCO ABRASIVE SYSTEMS LTD·Filed 1983·Granted Oct 22, 1985·32 cites·24 claims
- 0970US4872289ACutterDISCO ABRASIVE SYSTEMS LTD·Filed 1987·Granted Oct 10, 1989·26 cites·33 claims
- 1067US4843766ACutting tool having concentrically arranged outside and inside abrasive grain layers and method for production thereofDISCO ABRASIVE SYSTEMS LTD·Filed 1988·Granted Jul 4, 1989·19 cites·12 claims
- 1166US4672557AAutomatic accurate alignment systemDISCO ABRASIVE SYSTEMS LTD·Filed 1983·Granted Jun 9, 1987·19 cites·28 claims
- 1263US4720635AAutomatic accurate alignment systemDISCO ABRASIVE SYSTEMS LTD·Filed 1985·Granted Jan 19, 1988·33 cites·11 claims
- 1355US4839996AMethod and apparatus for machining hard, brittle and difficultly-machinable workpiecesDISCO ABRASIVE SYSTEMS LTD·Filed 1987·Granted Jun 20, 1989·10 cites·1 claims
- 1449US4696712ASemiconductor wafer mounting and cutting systemDISCO ABRASIVE SYSTEMS LTD·Filed 1985·Granted Sep 29, 1987·26 cites·10 claims
- 1547US4652135AArticle holding apparatus and its useDISCO ABRASIVE SYSTEMS LTD·Filed 1986·Granted Mar 24, 1987·10 cites·19 claims
- 1647US4603609AApparatus for cutting a sheet-like member applied to a surface of a semiconductor waferDISCO ABRASIVE SYSTEMS LTD·Filed 1984·Granted Aug 5, 1986·21 cites·4 claims
- 1746US4817341ACutting tool having concentrically arranged outside and inside abrasive grain layers and method for production thereofDISCO ABRASIVE SYSTEMS LTD·Filed 1988·Granted Apr 4, 1989·8 cites·11 claims
- 1844US4947598AMethod for grinding the surface of a semiconductor waferDISCO ABRASIVE SYSTEMS LTD·Filed 1983·Granted Aug 14, 1990·19 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →