Inventor · disambiguated record
Jeongnam Han
Also filed as: HAN JEONGNAM
11 granted patents·4 pending applications·60 citations·filing 2010–2017
89Inventor score
Top patents by PatentIndex Score
15 records- 0191US8859371B2Method for manufacturing semiconductor device having dual gate dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 14, 2014·16 cites·23 claims
- 0287US9859432B2Semiconductor devices having spacer protection patternSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·6 cites·20 claims
- 0386US9117692B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 25, 2015·7 cites·12 claims
- 0485US8790988B2Semiconductor devices having passive element in recessed portion of device isolation pattern and methods of fabricating the sameCHOI SUKHUN·Filed 2013·Granted Jul 29, 2014·8 cites·7 claims
- 0583US8841769B2Semiconductor device having metal plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·7 cites·20 claims
- 0681US9716162B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 25, 2017·3 cites·20 claims
- 0779US10128336B2Semiconductor devices and methods for manufacturing the samePARK SANGJINE·Filed 2016·Granted Nov 13, 2018·3 cites·22 claims
- 0879US9966432B2Semiconductor devices including an etch stop pattern and a sacrificial pattern with coplanar upper surfaces and a gate and a gap fill pattern with coplanar upper surfacesPARK SANGJINE·Filed 2016·Granted May 8, 2018·3 cites·28 claims
- 0979US8889552B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·12 claims
- 1056US8228089B2Wafer test method and wafer test apparatusKIM YOUNGOK·Filed 2010·Granted Jul 24, 2012·1 cites·5 claims
- 1149US2017301773A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1246US2012086048A1Semiconductor devices and methods for manufacturing the samePARK SANGJINE·Filed 2011·Application pending·0 cites
- 1345US2015108584A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1442US8901663B2Semiconductor devices having passive element in recessed portion of device isolation pattern and methods of fabricating the sameCHOI SUKHUN·Filed 2010·Granted Dec 2, 2014·0 cites·18 claims
- 1541US2013149835A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →