Inventor · disambiguated record
Jia-Sheng Lee
Also filed as: LEE JIA · LEE JIA SHENG
27 granted patents·6 pending applications·1,122 citations·filing 1998–2022
97Inventor score
Files withUNITED MICROELECTRONICS CORP18APPLIED MATERIALS INC5BALSEANU MIHAELA2AGENCY SCIENCE TECH & RES1SHENYANGFORTUNEPRECISIONEQUIPMENT CO LTD1
Top patents by PatentIndex Score
33 records- 0198US8129290B2Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cureBALSEANU MIHAELA·Filed 2006·Granted Mar 6, 2012·492 cites·16 claims
- 0297US6764958B1Method of depositing dielectric filmsAPPLIED MATERIALS INC·Filed 2000·Granted Jul 20, 2004·314 cites·45 claims
- 0391US7566655B2Integration process for fabricating stressed transistor structureAPPLIED MATERIALS INC·Filed 2006·Granted Jul 28, 2009·20 cites·12 claims
- 0487US9356188B2Tensile separation of a semiconducting stackVEECO INSTR INC·Filed 2014·Granted May 31, 2016·5 cites·24 claims
- 0587US6272736B1Method for forming a thin-film resistorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 14, 2001·88 cites·30 claims
- 0684US8753989B2Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cureBALSEANU MIHAELA·Filed 2012·Granted Jun 17, 2014·5 cites·14 claims
- 0779US7117064B2Method of depositing dielectric filmsAPPLIED MATERIALS INC·Filed 2006·Granted Oct 3, 2006·5 cites·20 claims
- 0873US6207560B1Method for manufacturing thin-film resistorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 27, 2001·41 cites·11 claims
- 0971US6777171B2Fluorine-containing layers for damascene structuresAPPLIED MATERIALS INC·Filed 2001·Granted Aug 17, 2004·12 cites·67 claims
- 1065US7001850B2Method of depositing dielectric filmsAPPLIED MATERIALS INC·Filed 2004·Granted Feb 21, 2006·7 cites·32 claims
- 1165US6071763AMethod of fabricating layered integrated circuitUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 6, 2000·24 cites·20 claims
- 1263US2024335589A1Methods and apparatus for decellularization of biological tissues and organsAGENCY SCIENCE TECH & RES·Filed 2022·Application pending·0 cites
- 1360US6225183B1Method of fabricating a thin-film resistor having stable resistanceUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 1, 2001·17 cites·8 claims
- 1456US6124615AStacked semiconductor structure for high integration of an integrated circuit with junction devicesUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 26, 2000·16 cites·23 claims
- 1550US7026580B2Adjustable exhaust flow for thermal uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 11, 2006·2 cites·15 claims
- 1648US6228735B1Method of fabricating thin-film transistorUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 8, 2001·10 cites·12 claims
- 1747US6489882B2Thin-film resistorUNITED MICROELECTRONICS CORP·Filed 2001·Granted Dec 3, 2002·3 cites·5 claims
- 1845US6117789AMethod of manufacturing thin film resistor layerUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 12, 2000·9 cites·11 claims
- 1944US6121667APhoto diodeUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 19, 2000·10 cites·4 claims
- 2043US6013545AMethod of manufacturing high-voltage metal-oxide-semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 11, 2000·8 cites·52 claims
- 2141US6524925B1Method of forming a thin-film resistor in a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 25, 2003·7 cites·10 claims
- 2241US5891770AMethod for fabricating a high bias metal oxide semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 6, 1999·9 cites·51 claims
- 2340US2020140987A1Direct write plasma spraying technology applied to the semiconductor industrySHENYANGFORTUNEPRECISIONEQUIPMENT CO LTD·Filed 2018·Application pending·0 cites
- 2438US6316325B1Method for fabricating a thin film resistorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 13, 2001·7 cites·20 claims
- 2536US2001016396A1Thin-film resistor and method of fabricationFiled 2001·Application pending·0 cites
- 2634US6156618AMethod for fabricating thin film resistorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Dec 5, 2000·3 cites·10 claims
- 2733US2002130102A1Method of forming a thin-film resistor employed in a semiconductor waterFiled 2001·Application pending·0 cites
- 2833US2001017397A1Thin-film resistor and method of fabricationFiled 2001·Application pending·0 cites
- 2933US2002140053A1Thin-film resistor and method of fabricationFiled 2001·Application pending·0 cites
- 3032US6207521B1Thin-film resistor employed in a semiconductor wafer and its method formationUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 27, 2001·2 cites·5 claims
- 3132US6110764AMethod of manufacturing an assembly with different types of high-voltage metal-oxide-semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 29, 2000·2 cites·13 claims
- 3232US6103589AHigh-voltage device substrate structure and method of fabricationUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 15, 2000·2 cites·23 claims
- 3332US6037229AHigh-voltage device substrate structure and method of fabricationUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 14, 2000·2 cites·17 claims
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