Inventor · disambiguated record
Hiroki Shinkawata
Also filed as: SHINKAWATA HIROKI
31 granted patents·5 pending applications·489 citations·filing 1994–2025
97Inventor score
Top patents by PatentIndex Score
36 records- 0192US5436477ASemiconductor memory device with high dielectric capacitor structureMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 25, 1995·80 cites·7 claims
- 0290US5604145AMethod of manufacturing DRAM capable of randomly inputting/outputting memory information at randomMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 18, 1997·66 cites·2 claims
- 0389US8367432B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 5, 2013·9 cites·19 claims
- 0485US8604553B2Semiconductor device and manufacturing method thereofSHINKAWATA HIROKI·Filed 2012·Granted Dec 10, 2013·8 cites·6 claims
- 0582US7078758B2Semiconductor device having memory and logic devices with reduced resistance and leakage currentRENESAS TECH CORP·Filed 2004·Granted Jul 18, 2006·18 cites·8 claims
- 0681US6759720B2Semiconductor device with transfer gate having gate insulating film and gate electrode layerRENESAS TECH CORP·Filed 2001·Granted Jul 6, 2004·32 cites·15 claims
- 0780US5717236ASemiconductor memory including stacked capacitor having a flat surfaceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 10, 1998·62 cites·23 claims
- 0878US7586141B2High speed memory device with reduced resistance and leakage currentRENESAS TECH CORP·Filed 2007·Granted Sep 8, 2009·4 cites·6 claims
- 0977US10790355B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Sep 29, 2020·2 cites·16 claims
- 1077US8211716B2Manufacturing method of a semiconductor device, a semiconductor wafer, and a test methodSHINKAWATA HIROKI·Filed 2009·Granted Jul 3, 2012·5 cites·16 claims
- 1176US5796136ADRAM semiconductor device with composite bit lineMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 18, 1998·52 cites·8 claims
- 1275US6690045B2Semiconductor device with reduced CMP dishingRENESAS TECH CORP·Filed 2001·Granted Feb 10, 2004·17 cites·7 claims
- 1374US8492813B2Semiconductor device and semiconductor device manufacturing methodSHINKAWATA HIROKI·Filed 2011·Granted Jul 23, 2013·2 cites·7 claims
- 1470US7919799B2Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2007·Granted Apr 5, 2011·2 cites·5 claims
- 1569US5828096ASemiconductor device having a contact holeMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Oct 27, 1998·40 cites·12 claims
- 1668US7329575B2Semiconductor device and semiconductor device manufacturing methodRENESAS TECH CORP·Filed 2006·Granted Feb 12, 2008·2 cites·6 claims
- 1768US6194757B1Semiconductor device having contact hole and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Feb 27, 2001·21 cites·5 claims
- 1863US6680539B2Semiconductor device, semiconductor device pattern designing method, and semiconductor device pattern designing apparatusRENESAS TECH CORP·Filed 2000·Granted Jan 20, 2004·13 cites·3 claims
- 1962US6627937B2Semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Sep 30, 2003·10 cites·7 claims
- 2060US6383857B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 7, 2002·8 cites·5 claims
- 2156US8647944B2Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 11, 2014·0 cites·5 claims
- 2256US6522002B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·7 cites·10 claims
- 2355US10008429B2Semiconductor device and semiconductor device measuring methodRENESAS ELECTRONICS CORP·Filed 2017·Granted Jun 26, 2018·0 cites·4 claims
- 2454US9824945B2Semiconductor device and semiconductor device measuring methodRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·0 cites·14 claims
- 2553US5566104AMemory cell layout structure for a semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 15, 1996·14 cites·9 claims
- 2653US2025351430A1Manufacturing method of a semiconductor wafer and a semiconductor waferRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2752US11705361B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2021·Granted Jul 18, 2023·0 cites·16 claims
- 2851US8058679B2Semiconductor device and semiconductor device manufacturing methodSHINKAWATA HIROKI·Filed 2011·Granted Nov 15, 2011·0 cites·5 claims
- 2949US6593609B2Semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 15, 2003·4 cites·4 claims
- 3049US6472704B2Semiconductor device having contact hole and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 29, 2002·3 cites·4 claims
- 3143US6919256B2Method of manufacturing semiconductor device having MIM capacitorRENESAS TECH CORP·Filed 2003·Granted Jul 19, 2005·2 cites·2 claims
- 3238US6222268B1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Apr 24, 2001·6 cites·6 claims
- 3337US2003178658A1Semiconductor memory and method of manufacture thereofFiled 2002·Application pending·0 cites
- 3436US2005009269A1Semiconductor device and method of manufacturing semiconductor deviceFiled 2004·Application pending·0 cites
- 3533US2015287746A1Method of manufacturing semiconductor device, and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3629US2001013618A1Semiconductor device and method of fabricating the sameFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →