Inventor · disambiguated record
Young-Jin Wee
Also filed as: WEE YOUNG-JIN
12 granted patents·253 citations·filing 1996–2007
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0188US6333260B1Semiconductor device having improved metal line structure and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 25, 2001·89 cites·28 claims
- 0280US6842028B2Apparatus for testing reliability of interconnection in integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 11, 2005·21 cites·12 claims
- 0378US6249056B1Low resistance interconnect for a semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 19, 2001·51 cites·9 claims
- 0474US7192864B2Method of forming interconnection lines for semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 20, 2007·5 cites·16 claims
- 0574US6693446B2Apparatus for testing reliability of interconnection in integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 17, 2004·18 cites·15 claims
- 0673US6483162B2Semiconductor device having improved metal line structure and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 19, 2002·18 cites·9 claims
- 0766US7635645B2Method for forming interconnection line in semiconductor device and interconnection line structureSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 22, 2009·6 cites·6 claims
- 0864US7638423B2Semiconductor device and method of forming wires of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 29, 2009·8 cites·19 claims
- 0961US7341908B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 11, 2008·1 cites·34 claims
- 1053US6004876ALow resistance interconnect for a semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Dec 21, 1999·17 cites·13 claims
- 1150US6690187B2Apparatus for testing reliability of interconnection in integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 10, 2004·4 cites·6 claims
- 1248US5814556AMethod of filling a contact hole in a semiconductor substrate with a metalSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Sep 29, 1998·15 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →