Inventor · disambiguated record
Keiji Ohori
Also filed as: OHORI Keiji
4 granted patents·5 pending applications·5 citations·filing 2019–2025
67Inventor score
Top patents by PatentIndex Score
9 records- 0196US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0286US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0385US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 0481US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 0580US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 0672US12342467B2Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated componentSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 24, 2025·1 cites·42 claims
- 0772US2025287559A1Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated componentSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0853US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 0946US2022315418A1Method for transferring microstructures, and method for mounting microstructuresSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →