Inventor · disambiguated record
Chien-Ting Ho
Also filed as: HO CHIEN-TING
53 granted patents·6 pending applications·136 citations·filing 2011–2024
97Inventor score
Files withUNITED MICROELECTRONICS CORP37HTC CORP17HO CHIEN-TING2POWERCHIP SEMICONDUCTOR MFG CORP2SU CHIH-CHIN1
Top patents by PatentIndex Score
59 records- 0197US10074656B1Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 11, 2018·19 cites·10 claims
- 0295US9859283B1Semiconductor memory structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 2, 2018·10 cites·18 claims
- 0393US10079277B2Method of fabricating metal-insulator-metal capacitorUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 18, 2018·9 cites·12 claims
- 0493US10068907B1Dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 4, 2018·10 cites·15 claims
- 0593US9929162B1Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 27, 2018·9 cites·18 claims
- 0692US9960167B1Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 1, 2018·7 cites·8 claims
- 0791US11508614B2Method of forming semiconductor device having capped air gaps between buried bit lines and buried gateUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 22, 2022·2 cites·10 claims
- 0890US9679901B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·6 cites·10 claims
- 0988US10854676B2Semiconductor device having capped air caps between buried bit lines and buried gateUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 1, 2020·4 cites·9 claims
- 1088US9985035B1Semiconductor memory structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·4 cites·19 claims
- 1187US10546861B2Semiconductor device for avoiding short circuit between adjacent storage nodes and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 28, 2020·4 cites·6 claims
- 1286US10361209B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 23, 2019·4 cites·6 claims
- 1386US9461500B2Wireless charging receiving device and wireless charging system using the sameHTC CORP·Filed 2013·Granted Oct 4, 2016·9 cites·6 claims
- 1484US11049863B2Semiconductor structure with capacitor landing pad and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 29, 2021·3 cites·5 claims
- 1583US10181473B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 15, 2019·4 cites·11 claims
- 1681US10169521B2Method for forming contact plug layoutUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·3 cites·19 claims
- 1779US10672864B2Manufacturing method of semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 2, 2020·2 cites·9 claims
- 1878US10396073B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 27, 2019·2 cites·5 claims
- 1978US10276650B2Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·2 cites·10 claims
- 2077US10170481B2Semiconductor memory device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 1, 2019·2 cites·16 claims
- 2176US11765881B2Semiconductor structure with capacitor landing pad and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 19, 2023·0 cites·8 claims
- 2276US10862211B2Integrated antenna structureHTC CORP·Filed 2018·Granted Dec 8, 2020·2 cites·20 claims
- 2375US9577468B2Wireless charging receiving device and wireless charging system using the sameHTC CORP·Filed 2016·Granted Feb 21, 2017·2 cites·11 claims
- 2472US10431587B2Semiconductor device for avoiding short circuit between adjacent storage nodes and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·1 cites·5 claims
- 2571US11658409B2Antenna structureHTC CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2671US11563012B2Semiconductor structure with capacitor landing pad and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 24, 2023·0 cites·6 claims
- 2771US10347642B2Manufacturing method of semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 9, 2019·1 cites·11 claims
- 2871US10250062B2Energy harvesting timerHTC CORP·Filed 2014·Granted Apr 2, 2019·3 cites·10 claims
- 2971US9766332B2Non-contact monitoring system and method thereofHTC CORP·Filed 2014·Granted Sep 19, 2017·4 cites·18 claims
- 3067US10490557B2Semiconductor structure with contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 26, 2019·1 cites·17 claims
- 3167US8811911B2Radio-frequency processing device and method and related wireless communication deviceSU CHIH-CHIN·Filed 2011·Granted Aug 19, 2014·4 cites·13 claims
- 3266US2025365930A1Dynamic random access memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2024·Application pending·0 cites
- 3362US9547282B2Wearable device with wireless transmission and method for manufacturing the sameHTC CORP·Filed 2015·Granted Jan 17, 2017·1 cites·22 claims
- 3460US10763260B2Semiconductor device and method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 1, 2020·0 cites·9 claims
- 3560US10553591B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 4, 2020·0 cites·6 claims
- 3660US9706356B2Positioning system and methodHTC CORP·Filed 2015·Granted Jul 11, 2017·1 cites·14 claims
- 3760US2025140750A1Memory devicePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2023·Application pending·0 cites
- 3859US11018006B2Method for patterning a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 25, 2021·0 cites·9 claims
- 3957US11588237B2Antenna structureHTC CORP·Filed 2018·Granted Feb 21, 2023·0 cites·14 claims
- 4057US10276577B2Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·0 cites·13 claims
- 4157US10236294B2Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 19, 2019·0 cites·10 claims
- 4256US10475648B1Method for patterning a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·10 claims
- 4356US2019333913A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 4455US10770789B2Antenna structureHTC CORP·Filed 2019·Granted Sep 8, 2020·0 cites·19 claims
- 4553US9048815B2Method for performing dynamic impedance matching and a communication apparatus thereofHO CHIEN-TING·Filed 2011·Granted Jun 2, 2015·1 cites·11 claims
- 4652US9773790B1Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 26, 2017·0 cites·12 claims
- 4751US10670958B2Method for forming a layout patternUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 4850US9634637B2Method for performing dynamic impedance matching and a communication apparatus thereofHTC CORP·Filed 2015·Granted Apr 25, 2017·0 cites·8 claims
- 4949US9608473B2Near field communication and wireless charging device and switching method using the sameHTC CORP·Filed 2014·Granted Mar 28, 2017·0 cites·20 claims
- 5046US10204914B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·0 cites·8 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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