Inventor · disambiguated record
Nicolas Degrenne
Also filed as: DEGRENNE NICOLAS
14 granted patents·3 pending applications·22 citations·filing 2016–2022
86Inventor score
Files withMITSUBISHI ELECTRIC CORP17
Top patents by PatentIndex Score
17 records- 0193US11169201B2Diagnostic device and method to establish degradation state of electrical connection in power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Nov 9, 2021·9 cites·15 claims
- 0292US10705133B2Method and device for estimating level of damage or lifetime expectation of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 7, 2020·6 cites·8 claims
- 0382US11474146B2Method for estimating degradation of a wire-bonded power semi-conductor moduleMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Oct 18, 2022·4 cites·7 claims
- 0474US10622281B2Power module and method for manufacturing power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 14, 2020·2 cites·8 claims
- 0564US10782338B2Method and device for estimating level of damage or lifetime expectation of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 22, 2020·1 cites·13 claims
- 0653US12013428B2Method and device for monitoring gate signal of power semiconductorMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jun 18, 2024·0 cites·14 claims
- 0753US11378612B2Device and method for monitoring the health of a power semiconductor dieMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 5, 2022·0 cites·17 claims
- 0852US12270715B2Method for estimating parameters of a junction of a power semi-conductor element and power unitMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 8, 2025·0 cites·18 claims
- 0950US2025164545A1Measurement method of flatband voltage of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1048US11217378B2Inductive assembly and method of manufacturing inductive assemblyMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 4, 2022·0 cites·12 claims
- 1148US10732617B2Method, device and system for estimating level of damage of electric device using histogramsMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 4, 2020·0 cites·12 claims
- 1248US10495681B2System and method for determining if deterioration occurs in interface of semiconductor die of electric power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 3, 2019·0 cites·12 claims
- 1348US2025271490A1Method for detection of mismatch between parallel power electronic element, power electronic module, computer software, computer-readable non-transient recording mediumMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1446US11152934B2Device and method for controlling switchingMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 19, 2021·0 cites·9 claims
- 1545US10827619B2Printed circuit board and method for manufacturing printed circuit boardMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 3, 2020·0 cites·13 claims
- 1645US2024272222A1Method and device for increasing lifetime of power die or power moduleMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1743US11927619B2Power semi-conductor module, mask, measurement method, computer software, and recording mediumMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Mar 12, 2024·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →