Inventor · disambiguated record
Kazutaka Honda
Also filed as: HONDA KAZUTAKA
31 granted patents·11 pending applications·85 citations·filing 2008–2025
95Inventor score
Files withDENSO CORP20HITACHI CHEMICAL CO LTD11HONDA KAZUTAKA3RESONAC CORP2SAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
42 records- 0193US7612700B2Pipeline type A/D converter apparatus provided with precharge circuit for precharging sampling capacitorSEMICONDUCTOR TECH ACAD RES CT·Filed 2008·Granted Nov 3, 2009·35 cites·8 claims
- 0290US9958505B2Voltage sensing circuit and battery pack monitoring systemDENSO CORP·Filed 2017·Granted May 1, 2018·8 cites·12 claims
- 0386US12379425B2Battery monitoring deviceDENSO CORP·Filed 2023·Granted Aug 5, 2025·1 cites·10 claims
- 0482US11892514B2Battery monitoring systemDENSO CORP·Filed 2021·Granted Feb 6, 2024·1 cites·7 claims
- 0581US10250206B2Voltage detection circuitDENSO CORP·Filed 2017·Granted Apr 2, 2019·2 cites·11 claims
- 0680US8890565B2Logic signal transmission circuit with isolation barrierDENSO CORP·Filed 2013·Granted Nov 18, 2014·6 cites·15 claims
- 0775US8324968B2Amplifier circuit, signal processor circuit, and semiconductor integrated circuit deviceHONDA KAZUTAKA·Filed 2011·Granted Dec 4, 2012·6 cites·11 claims
- 0875US2025264540A1Battery monitoring deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0970US10156613B2Voltage detection deviceDENSO CORP·Filed 2016·Granted Dec 18, 2018·1 cites·8 claims
- 1069US11608455B2Adhesive for semiconductor device, and high productivity method for manufacturing said deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Mar 21, 2023·1 cites·14 claims
- 1168US10094883B2Voltage detecting device and battery pack monitoring systemDENSO CORP·Filed 2016·Granted Oct 9, 2018·1 cites·12 claims
- 1268US7898449B2Differential operational amplifier circuit correcting settling error for use in pipelined A/D converterSEMICONDUCTOR TECH ACAD RES CT·Filed 2009·Granted Mar 1, 2011·6 cites·5 claims
- 1367US8405538B2Cyclic A/D converterMAKIHARA TETSUYA·Filed 2011·Granted Mar 26, 2013·4 cites·6 claims
- 1466US10669454B2Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layerHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 2, 2020·1 cites·11 claims
- 1566US10429447B2Voltage sensing deviceDENSO CORP·Filed 2018·Granted Oct 1, 2019·1 cites·10 claims
- 1664US10734350B2Method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 4, 2020·1 cites·18 claims
- 1764US9678166B2Voltage detection deviceDENSO CORP·Filed 2014·Granted Jun 13, 2017·2 cites·8 claims
- 1864US9129898B2Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Sep 8, 2015·1 cites·11 claims
- 1963US9465083B2Voltage detecting device for assembled batteryDENSO CORP·Filed 2013·Granted Oct 11, 2016·3 cites·26 claims
- 2061US9024455B2Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor deviceHONDA KAZUTAKA·Filed 2010·Granted May 5, 2015·1 cites·7 claims
- 2159US10274544B2Route switching circuit and voltage detection deviceDENSO CORP·Filed 2014·Granted Apr 30, 2019·1 cites·15 claims
- 2259US2025328158A1Reference voltage generation circuitDENSO CORP·Filed 2025·Application pending·0 cites
- 2358US9431314B2Thermosetting resin composition for sealing packing of semiconductor, and semiconductor deviceENOMOTO TETSUYA·Filed 2011·Granted Aug 30, 2016·2 cites·7 claims
- 2458US2025311456A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2554US12270862B2Battery monitor systemDENSO CORP·Filed 2023·Granted Apr 8, 2025·0 cites·14 claims
- 2654US10605836B2Voltage detection deviceDENSO CORP·Filed 2018·Granted Mar 31, 2020·0 cites·15 claims
- 2754US9123734B2Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Granted Sep 1, 2015·0 cites·11 claims
- 2853US2025311455A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2953US2022283244A1Battery monitoring deviceDENSO CORP·Filed 2022·Application pending·0 cites
- 3048US2025014937A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 3147US9803111B2Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2012·Granted Oct 31, 2017·0 cites·13 claims
- 3247US8674502B2Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor deviceHONDA KAZUTAKA·Filed 2010·Granted Mar 18, 2014·0 cites·15 claims
- 3346US9425120B2Semiconductor device and production method thereforHITACHI CHEMICAL CO LTD·Filed 2013·Granted Aug 23, 2016·0 cites·12 claims
- 3446US2021351445A1Semiconductor deviceDENSO CORP·Filed 2021·Application pending·0 cites
- 3544US11795356B2Adhesive composition and semiconductor device production methodRESONAC CORP·Filed 2018·Granted Oct 24, 2023·0 cites·9 claims
- 3643US11181937B2Correction current output circuit and reference voltage circuit with correction functionDENSO CORP·Filed 2020·Granted Nov 23, 2021·0 cites·13 claims
- 3742US2015014842A1Semiconductor device and production method thereforHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 3841US11070226B2A/D conversion deviceDENSO CORP·Filed 2020·Granted Jul 20, 2021·0 cites·23 claims
- 3941US10224311B2Semiconductor adhesive, and semiconductor device and method for manufacturing sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 5, 2019·0 cites·20 claims
- 4041US2015035175A1Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 4139US2021242876A1Fluctuation suppression circuitDENSO CORP·Filed 2021·Application pending·0 cites
- 4236US2011241228A1Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →