Inventor · disambiguated record
Yuji Takaoka
Also filed as: TAKAOKA YUJI
25 granted patents·7 pending applications·332 citations·filing 1996–2022
95Inventor score
Files withSONY CORP16SONY SEMICONDUCTOR SOLUTIONS CORP5SUMITOMO CHEMICAL CO3HARADA YOSHIMICHI2NABE YOSHIHIRO2
Top patents by PatentIndex Score
32 records- 0197US7402901B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2006·Granted Jul 22, 2008·213 cites·4 claims
- 0291US7851880B2Solid-state imaging deviceSONY CORP·Filed 2007·Granted Dec 14, 2010·25 cites·7 claims
- 0390US9379155B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2015·Granted Jun 28, 2016·5 cites·16 claims
- 0486US10050074B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2016·Granted Aug 14, 2018·3 cites·20 claims
- 0584US6466723B2Cleaning tool for optical fiber connectorsNTT ADVANCED TECH KK·Filed 2001·Granted Oct 15, 2002·27 cites·29 claims
- 0683US11315970B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2018·Granted Apr 26, 2022·2 cites·18 claims
- 0781US9041179B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2014·Granted May 26, 2015·3 cites·5 claims
- 0879US8252628B2Semiconductor device and method of manufacturing the sameNABE YOSHIHIRO·Filed 2008·Granted Aug 28, 2012·6 cites·6 claims
- 0978US11676977B2Semiconductor deviceSONY GROUP CORP·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 1074US11239529B2Film production methodSUMITOMO CHEMICAL CO·Filed 2019·Granted Feb 1, 2022·0 cites·8 claims
- 1172US10418340B2Semiconductor chip mounted on a packaging substrateSONY CORP·Filed 2015·Granted Sep 17, 2019·2 cites·17 claims
- 1270US6936525B2Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereofSONY CORP·Filed 2002·Granted Aug 30, 2005·15 cites·11 claims
- 1369US11800249B2Imaging device for connection with a circuit elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Oct 24, 2023·0 cites·16 claims
- 1462US10014248B2Semiconductor device with less positional deviation between aperture and solderSONY CORP·Filed 2015·Granted Jul 3, 2018·1 cites·17 claims
- 1560US2017092912A1Film production method, battery separator film, nonaqueous electrolyte secondary battery separator, and nonaqueous electrolyte secondary batterySUMITOMO CHEMICAL CO·Filed 2016·Application pending·0 cites
- 1659US8564101B2Semiconductor apparatus having a through-hole interconnectionHARADA YOSHIMICHI·Filed 2009·Granted Oct 22, 2013·2 cites·2 claims
- 1757US11245863B2Imaging device for connection with a circuit elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Feb 8, 2022·0 cites·16 claims
- 1857US7064005B2Semiconductor apparatus and method of manufacturing sameSONY CORP·Filed 2002·Granted Jun 20, 2006·13 cites·8 claims
- 1956US7135378B2Process for fabricating a semiconductor device having a plurality of encrusted semiconductor chipsSONY CORP·Filed 2003·Granted Nov 14, 2006·6 cites·5 claims
- 2052US2025255028A1Imaging device, electronic device, and method for manufacturing imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2152US2012286387A1Semiconductor device and method of manufacturing the sameNABE YOSHIHIRO·Filed 2012·Application pending·0 cites
- 2249US2008138932A1Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2008·Application pending·0 cites
- 2345US11356584B2Camera module, production method, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jun 7, 2022·0 cites·9 claims
- 2444US10720459B2Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficientsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jul 21, 2020·0 cites·12 claims
- 2543US2017239878A1Expander device, porous film producing apparatus, and porous film producing methodSUMITOMO CHEMICAL CO·Filed 2017·Application pending·0 cites
- 2642US8273657B2Method for manufacturing a semiconductor apparatus having a through-hole interconnectionHARADA YOSHIMICHI·Filed 2011·Granted Sep 25, 2012·0 cites·4 claims
- 2737US2002011655A1Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereofFiled 2001·Application pending·0 cites
- 2836US10720402B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2015·Granted Jul 21, 2020·0 cites·15 claims
- 2936US5827436AMethod for etching aluminum metal filmsSONY CORP·Filed 1996·Granted Oct 27, 1998·9 cites·20 claims
- 3036US2002004257A1Semiconductor device and process for fabricating the sameFiled 2001·Application pending·0 cites
- 3134US10867950B2Semiconductor device with a gap control electrode and method of manufacturing the semiconductor deviceSONY CORP·Filed 2015·Granted Dec 15, 2020·0 cites·15 claims
- 3231US11171170B2Image sensor package with flexible printed circuitsSONY CORP·Filed 2016·Granted Nov 9, 2021·0 cites·6 claims
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