Inventor · disambiguated record
Haryanto Chandra
Also filed as: CHANDRA HARYANTO
10 granted patents·177 citations·filing 1999–2012
90Inventor score
Files withNAT SEMICONDUCTOR CORP4CHANDRA HARYANTO2INFINEON TECHNOLOGIES CORP2PHILIPS LUMILEDS LIGHTING CO1VISHAY INFRARED COMPONENTS INC1
Top patents by PatentIndex Score
10 records- 0197US7344952B2Laminating encapsulant film containing phosphor over LEDsPHILIPS LUMILEDS LIGHTING CO·Filed 2005·Granted Mar 18, 2008·91 cites·22 claims
- 0294US8450147B2Laminating encapsulant film containing phosphor over LEDsCHANDRA HARYANTO·Filed 2012·Granted May 28, 2013·17 cites·30 claims
- 0376US8736036B2Laminating encapsulant film containing phosphor over LEDsCHANDRA HARYANTO·Filed 2008·Granted May 27, 2014·5 cites·8 claims
- 0475US7099536B1Single lens system integrating both transmissive and reflective surfaces for light focusing to an optical fiber and light reflection back to a monitor photodetectorNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 29, 2006·17 cites·24 claims
- 0571US6863450B2Optical sub-assembly packaging techniques that incorporate optical lensesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 8, 2005·11 cites·9 claims
- 0662US6508970B2Liquid transfer molding system for encapsulating semiconductor integrated circuitsINFINEON TECHNOLOGIES CORP·Filed 1999·Granted Jan 21, 2003·24 cites·8 claims
- 0760US7073961B2Optical sub-assembly packaging techniques that incorporate optical lensesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Jul 11, 2006·2 cites·17 claims
- 0859US7153462B2Injection casting system for encapsulating semiconductor devices and method of useVISHAY INFRARED COMPONENTS INC·Filed 2004·Granted Dec 26, 2006·3 cites·23 claims
- 0955US6503433B2Liquid transfer molding system for encapsulating semiconductor integrated circuitsINFINEON TECHNOLOGIES CORP·Filed 2001·Granted Jan 7, 2003·6 cites·4 claims
- 1054US7431516B2Optical sub-assembly packaging techniques that incorporate optical lensesNAT SEMICONDUCTOR CORP·Filed 2006·Granted Oct 7, 2008·1 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →