Inventor · disambiguated record
Pramod Subramonium
Also filed as: SUBRAMONIUM PRAMOD
34 granted patents·10 pending applications·2,827 citations·filing 2005–2023
98Inventor score
Files withNOVELLUS SYSTEMS INC18LAM RES CORP13ANTONELLI GEORGE ANDREW2SUBRAMONIUM PRAMOD2SWAMINATHAN SHANKAR2
Top patents by PatentIndex Score
44 records- 0198US10043655B2Plasma activated conformal dielectric film depositionNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 7, 2018·28 cites·20 claims
- 0298US9570274B2Plasma activated conformal dielectric film depositionNOVELLUS SYSTEMS INC·Filed 2015·Granted Feb 14, 2017·30 cites·11 claims
- 0398US9399228B2Method and apparatus for purging and plasma suppression in a process chamberNOVELLUS SYSTEMS INC·Filed 2013·Granted Jul 26, 2016·428 cites·8 claims
- 0498US8956983B2Conformal doping via plasma activated atomic layer deposition and conformal film depositionSWAMINATHAN SHANKAR·Filed 2012·Granted Feb 17, 2015·588 cites·41 claims
- 0598US7381644B1Pulsed PECVD method for modulating hydrogen content in hard maskNOVELLUS SYSTEMS INC·Filed 2005·Granted Jun 3, 2008·555 cites·31 claims
- 0697US8999859B2Plasma activated conformal dielectric film depositionNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 7, 2015·56 cites·25 claims
- 0797US8637411B2Plasma activated conformal dielectric film depositionSWAMINATHAN SHANKAR·Filed 2011·Granted Jan 28, 2014·99 cites·44 claims
- 0896US8591659B1Plasma clean method for deposition chamberFANG ZHIYUAN·Filed 2009·Granted Nov 26, 2013·550 cites·16 claims
- 0996US7981810B1Methods of depositing highly selective transparent ashable hardmask filmsNOVELLUS SYSTEMS INC·Filed 2006·Granted Jul 19, 2011·54 cites·19 claims
- 1096US7981777B1Methods of depositing stable and hermetic ashable hardmask filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 19, 2011·42 cites·16 claims
- 1196US7915166B1Diffusion barrier and etch stop filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Mar 29, 2011·70 cites·24 claims
- 1296US7906817B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Mar 15, 2011·40 cites·8 claims
- 1395US8669181B1Diffusion barrier and etch stop filmsYU YONGSIK·Filed 2011·Granted Mar 11, 2014·36 cites·16 claims
- 1495US8435608B1Methods of depositing smooth and conformal ashable hard mask filmsSUBRAMONIUM PRAMOD·Filed 2008·Granted May 7, 2013·62 cites·20 claims
- 1595US8110493B1Pulsed PECVD method for modulating hydrogen content in hard maskSUBRAMONIUM PRAMOD·Filed 2008·Granted Feb 7, 2012·49 cites·22 claims
- 1694US8741394B2In-situ deposition of film stacksHAVERKAMP JASON·Filed 2010·Granted Jun 3, 2014·25 cites·12 claims
- 1794US8288292B2Depositing conformal boron nitride film by CVD without plasmaANTONELLI GEORGE ANDREW·Filed 2010·Granted Oct 16, 2012·16 cites·30 claims
- 1893US9240320B1Methods of depositing smooth and conformal ashable hard mask filmsNOVELLUS SYSTEMS INC·Filed 2013·Granted Jan 19, 2016·15 cites·20 claims
- 1992US9633896B1Methods for formation of low-k aluminum-containing etch stop filmsLAM RES CORP·Filed 2015·Granted Apr 25, 2017·11 cites·20 claims
- 2092US9153482B2Methods and apparatus for selective deposition of cobalt in semiconductor processingLAM RES CORP·Filed 2014·Granted Oct 6, 2015·14 cites·18 claims
- 2189US9589799B2High selectivity and low stress carbon hardmask by pulsed low frequency RF powerLAM RES CORP·Filed 2014·Granted Mar 7, 2017·10 cites·17 claims
- 2289US8268722B2Interfacial capping layers for interconnectsYU JENGYI·Filed 2010·Granted Sep 18, 2012·13 cites·23 claims
- 2388US10214816B2PECVD apparatus for in-situ deposition of film stacksNOVELLUS SYSTEMS INC·Filed 2014·Granted Feb 26, 2019·6 cites·9 claims
- 2485US9028924B2In-situ deposition of film stacksNOVELLUS SYSTEMS INC·Filed 2012·Granted May 12, 2015·7 cites·14 claims
- 2584US8362571B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2011·Granted Jan 29, 2013·5 cites·17 claims
- 2683US12385138B2Plasma-enhanced deposition of film stacksNOVELLUS SYSTEMS INC·Filed 2023·Granted Aug 12, 2025·0 cites·11 claims
- 2782US8962101B2Methods and apparatus for plasma-based depositionNOVELLUS SYSTEMS INC·Filed 2013·Granted Feb 24, 2015·7 cites·19 claims
- 2882US8479683B2Apparatus including a plasma chamber and controller including instructions for forming a boron nitride layerANTONELLI GEORGE ANDREW·Filed 2012·Granted Jul 9, 2013·4 cites·1 claims
- 2977US11746420B2PECVD apparatus for in-situ deposition of film stacksNOVELLUS SYSTEMS INC·Filed 2018·Granted Sep 5, 2023·1 cites·13 claims
- 3076US11837441B2Depositing a carbon hardmask by high power pulsed low frequency RFLAM RES CORP·Filed 2020·Granted Dec 5, 2023·1 cites·25 claims
- 3176US10475627B2Carrier ring wall for reduction of back-diffusion of reactive species and suppression of local parasitic plasma ignitionLAM RES CORP·Filed 2016·Granted Nov 12, 2019·3 cites·18 claims
- 3270US8753978B2Metal and silicon containing capping layers for interconnectsYU JENGYI·Filed 2012·Granted Jun 17, 2014·2 cites·21 claims
- 3365US2024234091A9Depositing a carbon hardmask by high power pulsed low frequency rfLAM RES CORP·Filed 2023·Application pending·0 cites
- 3456US2014053867A1Plasma clean method for deposition chamberNOVELLUS SYSTEMS INC·Filed 2013·Application pending·0 cites
- 3553US2014216336A1Metal and silicon containing capping layers for interconnectsNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 3652US2025118568A1Reduced temperature etching of doped silicon oxideLAM RES CORP·Filed 2023·Application pending·0 cites
- 3751US2025054734A1Showerhead faceplate configurationsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3851US2025038034A1Method and apparatus for radio frequency grid design in an esc to reduce film asymmetryLAM RES CORP·Filed 2023·Application pending·0 cites
- 3950US2025316474A1High modulus carbon doped silicon oxide film for mold stack scaling solutions in advanced memory applicationsLAM RES CORP·Filed 2023·Application pending·0 cites
- 4045US2015380296A1Cleaning of carbon-based contaminants in metal interconnects for interconnect capping applicationsLAM RES CORP·Filed 2014·Application pending·0 cites
- 4141US12040180B2Nitride films with improved etch selectivity for 3D NAND integrationLAM RES CORP·Filed 2019·Granted Jul 16, 2024·0 cites·16 claims
- 4239US2013323930A1Selective Capping of Metal Interconnect Lines during Air Gap FormationCHATTOPADHYAY KAUSHIK·Filed 2012·Application pending·0 cites
- 4338US2012258261A1Increasing etch selectivity of carbon films with lower absorption co-efficient and stressREDDY SIRISH·Filed 2012·Application pending·0 cites
- 4435US10541117B2Systems and methods for tilting a wafer for achieving deposition uniformityLAM RES CORP·Filed 2015·Granted Jan 21, 2020·0 cites·18 claims
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