Inventor · disambiguated record
Sammy Mok
Also filed as: MOK SAMMY · MOK SAMMY L
26 granted patents·4 pending applications·1,439 citations·filing 1995–2009
98Inventor score
Files withNANONEXUS INC16VERIGY PTE LTD SINGAPORE4MICROMODULE SYSTEMS INC3INNOCONNEX INC2CHONG FU C1
Top patents by PatentIndex Score
30 records- 0199US6812718B1Massively parallel interface for electronic circuitsNANONEXUS INC·Filed 2000·Granted Nov 2, 2004·175 cites·91 claims
- 0298US7621761B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2007·Granted Nov 24, 2009·83 cites·18 claims
- 0397US6917525B2Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springsNANONEXUS INC·Filed 2002·Granted Jul 12, 2005·180 cites·67 claims
- 0497US6815961B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2002·Granted Nov 9, 2004·113 cites·10 claims
- 0597US6791171B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2001·Granted Sep 14, 2004·125 cites·109 claims
- 0696US7579848B2High density interconnect system for IC packages and interconnect assembliesNANONEXUS INC·Filed 2006·Granted Aug 25, 2009·72 cites·50 claims
- 0796US7009412B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2004·Granted Mar 7, 2006·62 cites·6 claims
- 0896US6799976B1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2000·Granted Oct 5, 2004·92 cites·4 claims
- 0995US7247035B2Enhanced stress metal spring contactorNANONEXUS INC·Filed 2004·Granted Jul 24, 2007·61 cites·22 claims
- 1093US7382142B2High density interconnect system having rapid fabrication cycleNANONEXUS INC·Filed 2005·Granted Jun 3, 2008·43 cites·29 claims
- 1191US7872482B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2007·Granted Jan 18, 2011·21 cites·24 claims
- 1290US7138818B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2006·Granted Nov 21, 2006·13 cites·25 claims
- 1389US7952373B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesVERIGY PTE LTD SINGAPORE·Filed 2006·Granted May 31, 2011·17 cites·16 claims
- 1489US7403029B2Massively parallel interface for electronic circuitNANONEXUS CORP·Filed 2006·Granted Jul 22, 2008·16 cites·27 claims
- 1588US8531202B2Probe card test apparatus and methodMOK SAMMY·Filed 2008·Granted Sep 10, 2013·23 cites·25 claims
- 1687US7876087B2Probe card repair using coupons with spring contacts and separate atachment pointsINNOCONNEX INC·Filed 2007·Granted Jan 25, 2011·14 cites·31 claims
- 1787US5619399AMultiple chip module mounting assembly and computer using sameMICROMODULE SYSTEMS INC·Filed 1995·Granted Apr 8, 1997·94 cites·31 claims
- 1886US7126220B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Oct 24, 2006·40 cites·25 claims
- 1984US5703753AMounting assembly for multiple chip module with more than one substrate and computer using sameMICROMODULE SYSTEMS INC·Filed 1996·Granted Dec 30, 1997·77 cites·22 claims
- 2083US5729433AMultiple chip module assembly for top of mother boardMICROMODULE SYSTEMS INC·Filed 1996·Granted Mar 17, 1998·75 cites·41 claims
- 2174US7126358B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2004·Granted Oct 24, 2006·13 cites·47 claims
- 2270US7137830B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Nov 21, 2006·14 cites·30 claims
- 2367US7812626B2High density interconnect system for IC packages and interconnect assembliesVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Oct 12, 2010·5 cites·12 claims
- 2461US7884634B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Feb 8, 2011·2 cites·8 claims
- 2557US7772860B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2008·Granted Aug 10, 2010·1 cites·16 claims
- 2657US6710609B2Mosaic decal probeNANONEXUS INC·Filed 2002·Granted Mar 23, 2004·8 cites·10 claims
- 2747US2007144841A1Miniaturized Contact SpringCHONG FU C·Filed 2006·Application pending·0 cites
- 2841US2005068054A1Standardized layout patterns and routing structures for integrated circuit wafer probe card assembliesFiled 2004·Application pending·0 cites
- 2940US2009064498A1Membrane spring fabrication processINNOCONNEX INC·Filed 2008·Application pending·0 cites
- 3033US2004075455A1Mosaic decal probeFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →