Inventor · disambiguated record
Fu Chiung Chong
Also filed as: CHONG FU C · CHONG FU CHIUNG
25 granted patents·8 pending applications·1,447 citations·filing 1982–2013
97Inventor score
Files withNANONEXUS INC17VERIGY PTE LTD SINGAPORE4CHONG FU CHIUNG3CHONG FU C2ADVANTEST SINGAPORE PTE LTD1
Top patents by PatentIndex Score
33 records- 0199US6812718B1Massively parallel interface for electronic circuitsNANONEXUS INC·Filed 2000·Granted Nov 2, 2004·175 cites·91 claims
- 0298US7621761B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2007·Granted Nov 24, 2009·83 cites·18 claims
- 0397US6917525B2Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springsNANONEXUS INC·Filed 2002·Granted Jul 12, 2005·180 cites·67 claims
- 0497US6815961B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2002·Granted Nov 9, 2004·113 cites·10 claims
- 0597US6791171B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2001·Granted Sep 14, 2004·125 cites·109 claims
- 0696US7579848B2High density interconnect system for IC packages and interconnect assembliesNANONEXUS INC·Filed 2006·Granted Aug 25, 2009·72 cites·50 claims
- 0796US7009412B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2004·Granted Mar 7, 2006·62 cites·6 claims
- 0896US6799976B1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2000·Granted Oct 5, 2004·92 cites·4 claims
- 0996US5973504AProgrammable high-density electronic device testingKULICKE & SOFFA IND INC·Filed 1997·Granted Oct 26, 1999·136 cites·8 claims
- 1095US7349223B2Enhanced compliant probe card systems having improved planarityNANONEXUS INC·Filed 2004·Granted Mar 25, 2008·110 cites·46 claims
- 1195US7247035B2Enhanced stress metal spring contactorNANONEXUS INC·Filed 2004·Granted Jul 24, 2007·61 cites·22 claims
- 1293US7382142B2High density interconnect system having rapid fabrication cycleNANONEXUS INC·Filed 2005·Granted Jun 3, 2008·43 cites·29 claims
- 1391US7872482B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2007·Granted Jan 18, 2011·21 cites·24 claims
- 1490US7138818B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2006·Granted Nov 21, 2006·13 cites·25 claims
- 1589US7952373B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesVERIGY PTE LTD SINGAPORE·Filed 2006·Granted May 31, 2011·17 cites·16 claims
- 1689US7403029B2Massively parallel interface for electronic circuitNANONEXUS CORP·Filed 2006·Granted Jul 22, 2008·16 cites·27 claims
- 1786US7126220B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Oct 24, 2006·40 cites·25 claims
- 1882US8575954B2Structures and processes for fabrication of probe card assemblies with multi-layer interconnectCHONG FU CHIUNG·Filed 2008·Granted Nov 5, 2013·20 cites·44 claims
- 1978US4480318AMethod of programming of junction-programmable read-only memoriesFAIRCHILD CAMERA INSTR CO·Filed 1982·Granted Oct 30, 1984·25 cites·6 claims
- 2074US7126358B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2004·Granted Oct 24, 2006·13 cites·47 claims
- 2170US7137830B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Nov 21, 2006·14 cites·30 claims
- 2267US7812626B2High density interconnect system for IC packages and interconnect assembliesVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Oct 12, 2010·5 cites·12 claims
- 2361US7884634B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Feb 8, 2011·2 cites·8 claims
- 2457US7772860B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2008·Granted Aug 10, 2010·1 cites·16 claims
- 2557US6710609B2Mosaic decal probeNANONEXUS INC·Filed 2002·Granted Mar 23, 2004·8 cites·10 claims
- 2653US2009090617A1Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered FilmsGIAUQUE PIERRE H·Filed 2006·Application pending·0 cites
- 2750US2013186746A1Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered FilmsADVANTEST SINGAPORE PTE LTD·Filed 2013·Application pending·0 cites
- 2847US2007144841A1Miniaturized Contact SpringCHONG FU C·Filed 2006·Application pending·0 cites
- 2943US2007245553A1Fine pitch microfabricated spring contact structure & methodCHONG FU C·Filed 2007·Application pending·0 cites
- 3042US2012023730A1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesCHONG FU CHIUNG·Filed 2011·Application pending·0 cites
- 3141US2005068054A1Standardized layout patterns and routing structures for integrated circuit wafer probe card assembliesFiled 2004·Application pending·0 cites
- 3236US2012212248A9Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card AssembliesCHONG FU CHIUNG·Filed 2007·Application pending·0 cites
- 3333US2004075455A1Mosaic decal probeFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Fu Chiung Chong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →