Inventor · disambiguated record
Masahiko Hasunuma
Also filed as: HASUNUMA MASAHIKO
51 granted patents·8 pending applications·1,107 citations·filing 1985–2017
99Inventor score
Top patents by PatentIndex Score
59 records- 0196US7420320B2Piezoelectric thin film device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Granted Sep 2, 2008·41 cites·7 claims
- 0295US7323805B2Piezoelectric thin film device and method for manufacturing the sameTOSHIBA KK·Filed 2005·Granted Jan 29, 2008·32 cites·15 claims
- 0393US7921401B2Stress analysis method, wiring structure design method, program, and semiconductor device production methodTOSHIBA KK·Filed 2007·Granted Apr 5, 2011·35 cites·16 claims
- 0493US6071810AMethod of filling contact holes and wiring grooves of a semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 6, 2000·101 cites·2 claims
- 0592US7351656B2Semiconductor device having oxidized metal film and manufacture method of the sameKABUSHIKI KAIHSA TOSHIBA·Filed 2006·Granted Apr 1, 2008·20 cites·19 claims
- 0692US7112883B2Semiconductor device with temperature control mechanismTOSHIBA KK·Filed 2005·Granted Sep 26, 2006·24 cites·19 claims
- 0792US6673704B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Jan 6, 2004·42 cites·26 claims
- 0892US4754950AValveTOSHIBA KK·Filed 1985·Granted Jul 5, 1988·65 cites·13 claims
- 0991US6306756B1Method for production of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Oct 23, 2001·62 cites·10 claims
- 1090US7180192B2Semiconductor deviceTOSHIBA KK·Filed 2005·Granted Feb 20, 2007·17 cites·8 claims
- 1190US6727593B2Semiconductor device with improved bondingTOSHIBA KK·Filed 2002·Granted Apr 27, 2004·48 cites·9 claims
- 1287US8922018B2Semiconductor device and semiconductor device manufacturing methodISHIZAKI TAKESHI·Filed 2012·Granted Dec 30, 2014·13 cites·9 claims
- 1387US7339256B2Semiconductor deviceTOSHIBA KK·Filed 2004·Granted Mar 4, 2008·47 cites·30 claims
- 1487US7301240B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Nov 27, 2007·12 cites·11 claims
- 1586US10043853B2Magnetic memory deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Aug 7, 2018·5 cites·20 claims
- 1685US6090701AMethod for production of semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 18, 2000·74 cites·11 claims
- 1784US7994054B2Semiconductor device having oxidized metal film and manufacture method of the sameTOSHIBA KK·Filed 2007·Granted Aug 9, 2011·6 cites·20 claims
- 1884US7635646B2Method for fabricating semiconductor deviceTOSHIBA KK·Filed 2008·Granted Dec 22, 2009·12 cites·20 claims
- 1984US6958542B2Semiconductor deviceTOSHIBA KK·Filed 2003·Granted Oct 25, 2005·29 cites·4 claims
- 2083US5247475ASuperconducting memory circuit and method of storing information in the same by generating and terminating a persistent currentSANYO ELECTRIC CO·Filed 1993·Granted Sep 21, 1993·72 cites·5 claims
- 2182US6746969B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted Jun 8, 2004·27 cites·27 claims
- 2280US7791202B2Semiconductor device having oxidized metal film and manufacture method of the sameTOSHIBA KK·Filed 2008·Granted Sep 7, 2010·4 cites·20 claims
- 2379US8148274B2Semiconductor device having oxidized metal film and manufacture method of the sameWADA JUNICHI·Filed 2008·Granted Apr 3, 2012·4 cites·12 claims
- 2477US7579696B2Semiconductor deviceTOSHIBA KK·Filed 2008·Granted Aug 25, 2009·7 cites·20 claims
- 2577US6552434B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2002·Granted Apr 22, 2003·18 cites·3 claims
- 2675US5709958AElectronic partsTOSHIBA KK·Filed 1995·Granted Jan 20, 1998·48 cites·12 claims
- 2774US7675183B2Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor deviceTOSHIBA KK·Filed 2008·Granted Mar 9, 2010·4 cites·11 claims
- 2874US6946387B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2003·Granted Sep 20, 2005·11 cites·2 claims
- 2974US6001461AElectronic parts and manufacturing method thereofTOSHIBA KK·Filed 1996·Granted Dec 14, 1999·44 cites·12 claims
- 3072US7770274B2Piezoelectric thin film device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Granted Aug 10, 2010·5 cites·6 claims
- 3172US7285859B2Semiconductor deviceTOSHIBA KK·Filed 2005·Granted Oct 23, 2007·5 cites·20 claims
- 3272US6975033B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 13, 2005·19 cites·16 claims
- 3370US8110497B2Method for manufacturing semiconductor deviceSAKATA ATSUKO·Filed 2009·Granted Feb 7, 2012·3 cites·20 claims
- 3469US6054770AElectric solid state device and method for manufacturing the deviceTOSHIBA KK·Filed 1997·Granted Apr 25, 2000·35 cites·21 claims
- 3562US7314827B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Jan 1, 2008·2 cites·19 claims
- 3661US7872353B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Jan 18, 2011·2 cites·20 claims
- 3761US6440843B1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2000·Granted Aug 27, 2002·5 cites·3 claims
- 3859US7067922B2Semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jun 27, 2006·7 cites·25 claims
- 3957US6436849B1Method for manufacturing semiconductor device having low dielectric constant insulating film, wafer processing equipment and wafer storing box used in this methodTOSHIBA KK·Filed 2001·Granted Aug 20, 2002·5 cites·9 claims
- 4056US6414394B1Semiconductor deviceTOSHIBA KK·Filed 2000·Granted Jul 2, 2002·6 cites·36 claims
- 4154US7097946B2Photomask, method of manufacturing a photomask, and method of manufacturing an electronic productTOSHIBA KK·Filed 2003·Granted Aug 29, 2006·4 cites·20 claims
- 4254US5187561AMetal single crystal line having a particular crystal orientationTOSHIBA KK·Filed 1990·Granted Feb 16, 1993·21 cites·28 claims
- 4353US6403462B1Method for manufacturing high reliability interconnection having diffusion barrier layerTOSHIBA KK·Filed 1999·Granted Jun 11, 2002·16 cites·44 claims
- 4453US2012152168A1Semiconductor device having oxidized metal film and manufacture method of the sameSAKATA ATSUKO·Filed 2012·Application pending·0 cites
- 4552US6069071AMethod of manufacturing an interconnect by dissolving an intermetallic compound film into a main component of a metal filmTOSHIBA KK·Filed 1997·Granted May 30, 2000·17 cites·19 claims
- 4651US7119442B2Semiconductor deviceTOSHIBA KK·Filed 2004·Granted Oct 10, 2006·4 cites·30 claims
- 4750US6580171B2Semiconductor wiring deviceTOSHIBA KK·Filed 2002·Granted Jun 17, 2003·3 cites·36 claims
- 4849US7601638B2Interconnect metallization method having thermally treated copper plate film with reduced micro-voidsTOSHIBA KK·Filed 2007·Granted Oct 13, 2009·0 cites·10 claims
- 4949US7095124B2Semiconductor deviceTOSHIBA KK·Filed 2004·Granted Aug 22, 2006·4 cites·17 claims
- 5049US2006113674A1Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2006·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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