Inventor · disambiguated record
Haruo Sorimachi
Also filed as: SORIMACHI HARUO
12 granted patents·2 pending applications·204 citations·filing 1982–2017
91Inventor score
Top patents by PatentIndex Score
14 records- 0185US10153177B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Dec 11, 2018·5 cites·5 claims
- 0278US5592735AMethod of making a multi-chip module having an improved heat dissipation efficiencyFUJITSU LTD·Filed 1996·Granted Jan 14, 1997·48 cites·3 claims
- 0378US5432675AMulti-chip module having thermal contactsFUJITSU LTD·Filed 1993·Granted Jul 11, 1995·63 cites·13 claims
- 0475US10516090B2Backing memberSHINKO ELECTRIC IND CO·Filed 2017·Granted Dec 24, 2019·1 cites·4 claims
- 0575US6951811B2Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor waferSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 4, 2005·19 cites·4 claims
- 0670US4595823AThermal printing head with an anti-abrasion layer and method of fabricating the sameFUJITSU LTD·Filed 1984·Granted Jun 17, 1986·15 cites·6 claims
- 0769US8355262B2Electronic component built-in substrate and method of manufacturing electronic component built-in substrateSHINKO ELECTRIC IND CO·Filed 2007·Granted Jan 15, 2013·4 cites·10 claims
- 0869US6791186B2Mounting substrate and structure having semiconductor element mounted on substrateSHINKO ELECTRIC IND CO·Filed 2002·Granted Sep 14, 2004·16 cites·36 claims
- 0963US7342248B2Semiconductor device and interposerSHINKO ELECTRIC IND CO·Filed 2004·Granted Mar 11, 2008·11 cites·7 claims
- 1057US4689638AThermal recording head and process for manufacturing wiring substrate thereforFUJITSU LTD·Filed 1985·Granted Aug 25, 1987·11 cites·13 claims
- 1145US4446355ACrossover construction of thermal-head and method of manufacturing sameFUJITSU LTD·Filed 1982·Granted May 1, 1984·11 cites·10 claims
- 1244US9087781B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 21, 2015·0 cites·7 claims
- 1341US2007085217A1Mounting board and semiconductor deviceSORIMACHI HARUO·Filed 2006·Application pending·0 cites
- 1434US2016143139A1Electronic component device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →