Inventor · disambiguated record
Thomas R. Sarubbi
Also filed as: SARUBBI THOMAS · SARUBBI THOMAS R
15 granted patents·1 pending application·145 citations·filing 1987–2007
93Inventor score
Files withOCG MICROELECTRONIC MATERIALS9OLIN HUNT SPECIALTY PROD4FUJIFILM ELECTRONIC MATERIALS2OCG MICROELECTRONIC MARTERIALS1
Top patents by PatentIndex Score
16 records- 0187US4837121AThermally stable light-sensitive compositions with o-quinone diazide and phenolic resinOLIN HUNT SPECIALTY PROD·Filed 1987·Granted Jun 6, 1989·36 cites·20 claims
- 0273US5001040AProcess of forming resist image in positive photoresist with thermally stable phenolic resinOLIN HUNT SPECIALTY PROD·Filed 1990·Granted Mar 19, 1991·21 cites·3 claims
- 0367US5413894AHigh ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted May 9, 1995·12 cites·15 claims
- 0464US5494785AHigh ortho-ortho bonded novolak binder resins and their use in a process for forming positive resist patternsOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Feb 27, 1996·15 cites·12 claims
- 0559US4959292ALight-sensitive o-quinone diazide composition and product with phenolic novolak prepared by condensation with haloacetoaldehydeOLIN HUNT SPECIALTY PROD·Filed 1988·Granted Sep 25, 1990·13 cites·18 claims
- 0658US5473045AHigh ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Dec 5, 1995·14 cites·20 claims
- 0753US4970287AThermally stable phenolic resin compositions with ortho, ortho methylene linkageOLIN HUNT SPECIALTY PROD·Filed 1989·Granted Nov 13, 1990·8 cites·13 claims
- 0849US7416821B2Thermally cured undercoat for lithographic applicationFUJIFILM ELECTRONIC MATERIALS·Filed 2005·Granted Aug 26, 2008·3 cites·24 claims
- 0946US5151339APhotoresist composition containing diazoquinone photosensitizer and novalak resin characterized by the complete and selective removal of dimeric species from the novolak resinOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Sep 29, 1992·6 cites·5 claims
- 1044US2008199814A1Device manufacturing process utilizing a double patterning processFUJIFILM ELECTRONIC MATERIALS·Filed 2007·Application pending·0 cites
- 1143US5132376AProcess for selective removal of dimeric species from phenolic polymersOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Jul 21, 1992·5 cites·9 claims
- 1239US5024921AThermally stable light-sensitive compositions with o-quinone diazide and phenolic resin used in a method of forming a positive photoresist imageOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Jun 18, 1991·5 cites·3 claims
- 1337US5306594ARadiation-sensitive compositions using novolak resins made from a substituted bis(hydroxyphenyl)methane and a bis-(methylol)-cresolOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Apr 26, 1994·3 cites·17 claims
- 1434US5053479AThermally stable phenolic resin compositions and their use in light-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Oct 1, 1991·3 cites·9 claims
- 1531US5350827ASelected structurally defined novolak binder resins and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1994·Granted Sep 27, 1994·1 cites·5 claims
- 1623US5338652ASelected structurally defined novolak binder resins and their use in photoresist pattern formationOCG MICROELECTRONIC MARTERIALS·Filed 1994·Granted Aug 16, 1994·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →