Inventor · disambiguated record
Jin Won Jeong
Also filed as: JEONG JIN-WON
18 granted patents·2 pending applications·62 citations·filing 2003–2023
91Inventor score
Files withMAGNACHIP SEMICONDUCTOR LTD9SAMSUNG ELECTRONICS CO LTD5COUPANG CORP3JEONG JIN-WON1KIM KEUNNAM1
Top patents by PatentIndex Score
20 records- 0193US11605052B2Systems and methods for electronic monitoring of inventory transferCOUPANG CORP·Filed 2021·Granted Mar 14, 2023·3 cites·20 claims
- 0292US9177891B2Semiconductor device including contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·12 cites·14 claims
- 0391US9607994B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 28, 2017·8 cites·19 claims
- 0491US9099343B2Semiconductor devicesKIM KEUNNAM·Filed 2013·Granted Aug 4, 2015·14 cites·20 claims
- 0584US9379114B2Semiconductor device and method of fabricating the sameJEONG JIN-WON·Filed 2012·Granted Jun 28, 2016·12 cites·18 claims
- 0683US10910270B2Method of forming and packaging semiconductor dieMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Feb 2, 2021·6 cites·12 claims
- 0782US11107033B2Systems and methods for electronic monitoring of inventory transferCOUPANG CORP·Filed 2019·Granted Aug 31, 2021·2 cites·18 claims
- 0879US8878293B2Semiconductor device having DC structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 4, 2014·5 cites·20 claims
- 0968US11901322B2Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor dieMAGNACHIP SEMICONDUCTOR LTD·Filed 2022·Granted Feb 13, 2024·0 cites·10 claims
- 1067US2024128123A1Method for forming semiconductor die and semiconductor device thereofMAGNACHIP SEMICONDUCTOR LTD·Filed 2023·Application pending·0 cites
- 1162US11887892B2Method for forming semiconductor die with die region and seal-ring regionMAGNACHIP SEMICONDUCTOR LTD·Filed 2021·Granted Jan 30, 2024·0 cites·19 claims
- 1259US11380640B2Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor dieMAGNACHIP SEMICONDUCTOR LTD·Filed 2020·Granted Jul 5, 2022·0 cites·14 claims
- 1351US9536868B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 1450US12456651B2Semiconductor die forming and packaging method using ultrashort pulse laser micromachiningMAGNACHIP SEMICONDUCTOR LTD·Filed 2021·Granted Oct 28, 2025·0 cites·16 claims
- 1550US11233000B2Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor packageMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Jan 25, 2022·0 cites·12 claims
- 1649US11097240B2Pickering emulsion composition using polyimide particles and preparation method thereofUNIV INDUSTRY FOUNDATION YONSEI UNIV WONJU CAMPUS·Filed 2017·Granted Aug 24, 2021·0 cites·8 claims
- 1749US10741521B2Semiconductor package and method of manufacturing semiconductor packageMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Aug 11, 2020·0 cites·15 claims
- 1848US11238405B2Electronic apparatus and operation method thereofCOUPANG CORP·Filed 2020·Granted Feb 1, 2022·0 cites·11 claims
- 1946US10705116B2Test socket of flexible semiconductor chip package and bending test method using the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2018·Granted Jul 7, 2020·0 cites·20 claims
- 2043US2004002862A1Voice recognition device, observation probability calculating device, complex fast fourier transform calculation device and method, cache device, and method of controlling the cache deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →